Probing alternatives – Atec Agilent-1670G User Manual

Page 17

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17

Probing the device under test is
both one of the potentially most
difficult and certainly one of
the most important tasks in
debugging a digital design. That
is why Agilent Technologies
provides a wider variety of
probing solutions than anyone
else in the industry—each with a
different set of advantages
particular to a given situation. We
like to think of it as helping you
get your signals off to a great
start.

Probing Alternatives

Probing Alternative

Advantages

Limitations

General-Purpose

Most flexible method. Works in

Can be cumbersome

Lead Sets and Surface

conjunction with SMD clips and Wedge

when connecting

Mount IC Clips

adapters listed below. Included with

a large number

(Figure 16 and 17)

logic analyzer purchase.

of channels.

Ultra-Fine Pitch Surface

Smallest IC clips in the industry to date

Same as above plus

Mount Device Clips

(down to 0.5 mm). Works with both logic

small incremental cost.

(Figure 18)

analyzer and scope probing systems. _

Wedge probe adapter

Compressible dual conductors between

Same as above plus

for QFP Packages

adjacent IC legs make 3-16 adjacent signal

small incremental cost.

(Figure 19)

leads available to logic analyzer and
scope probing systems.

Elastomeric and Locator

Provides access to all signal leads for

Requires minimal

Base Solutions for Generic

generic QFP packages (including custom

keep out area.

QFP Packages

ICs). Uses combination of one probe

Moderate to significant

(Figure 20)

adapter and four flexible adapters, plus

incremental cost.

general-purpose lead sets.

Direct Connection to

Very reliable and convenient probing

Requires advance

Device Under Test via

system when frequent probing

planning to integrate

Built-In Connectors

connections are required (manufacturing

into design process.

(Figure 21 and 22)

or field test for example). Connectors

Moderate (normal

can be located at optimal position in

density) to significant

the device under test. Can work in

(high density)

conjunction with Agilent provided

incremental cost.

inverse assemblers.

Analysis Probes

Support for over 200 different

Requires moderate

for Specific Processors

processors and buses. Includes

clearance around

and Buses

reliable logic analyzer probe

processor or bus.

pod connectors, logic analyzer

Moderate to significant

configuration files and device

extra cost depending on

specific inverse assemblers.

specific processor or bus.

Figure 16. General-Purpose Lead Sets

Figure 17. Surface Mount IC Clips

Figure 18. Ultra-Fine Pitch Surface Mount

Device Clips

Figure 19. Agilent Wedge Probe Adapters for

QFP Package

Agilent Wedge Probe Adapter

IC leg spacing

Number of signals

Number of wedges in pack

Model number

0.5 mm

3

1

E2613A

0.5 mm

3

2

E2613B

0.5 mm

8

1

E2614A

0.5 mm

16

1

E2643A

0.65 mm

3

1

E2615A

0.65 mm

3

2

E2615B

0.65 mm

8

1

E2616A

0.65 mm

16

1

E2644A

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