Dell Intel PRO Family of Adapters - Manual (Page 144)

Intel® 10 Gigabit Network Mezzanine Card Specifications
Feature
Intel® Ethernet X520 10GbE Dual Port KX4-
KR Mezz Intel® Ethernet X520 10GbE Dual Port
KX4 Mezz
Bus Connector PCI Express 2.0 PCI Express 2.0
Bus Speed x8 x8
Power Requirements 7.4 Watts (maximum) @ 3.3 V 7.4 Watts (maximum) @ 3.3 V
Dimensions 3.65 x 3.3 in. 3.65 x 3.3 in.
Operating Tem-
perature 32 - 131 deg. F (0 - 55 deg. C) 32 - 131 deg. F (0 - 55 deg. C)
MTBF 147 years 147 years
Available Speeds 10 Gbps/1 Gbps 10 Gbps/1 Gbps
Duplex Modes Full only Full only
Standards Con-
formance IEEE 802.1p
IEEE 802.1Q
IEEE 802.3ac
IEEE 802.3ad
IEEE 802.3ae
IEEE 802.3x
ACPI v1.0
PCI Express 2.0 IEEE 802.1p
IEEE 802.1Q
IEEE 802.3ac
IEEE 802.3ad
IEEE 802.3ae
IEEE 802.3x
ACPI v1.0
PCI Express 2.0
Regulatory and
Safety Safety Compliance
l UL 60950 Third Edition- CAN/CSA-C22.2 No.60950-00 (USA/Canada)
l EN 60 950 (European Union)
l IEC 60 950 (International)
EMC Compliance
l FCC Part 15 - Radiated & Conducted Emissions (USA)
l ICES-003 - Radiated & Conducted Emissions (Canada)
l CISPR 22 - Radiated & Conducted Emissions (International)
l EN55022-1998 - Radiated & Conducted Emissions (European Union)
l EN55024 - 1998 - (Immunity) (European Union)
l CE - EMC Directive (89/336/EEC) (European Union)
l VCCI - Radiated & Conducted Emissions (Japan)
l CNS13438 - Radiated & Conducted Emissions (Taiwan)
l AS/NZS3548 - Radiated & Conducted Emissions (Australia/New Zealand)
l MIC notice 1997-41, EMI and MIC notice 1997-42 - EMS (Korea)
Intel® 10GbE Network Daughter Cards (NDC)
Feature
Intel® Ethernet 10G 4P X540/I350
rNDC Intel® Ethernet 10G 4P X520/I350
rNDC Intel® Ethernet 10G
2P X520-k bNDC
Bus Connector PCI Express 2.0 PCI Express 2.0 PCI Express 2.0
Bus Speed x8 2 x8 x8
Transmission
Mode/Connector Twisted copper/RJ-45 SFP+ Copper/Backplane
Cabling 1000Base-T (Category 5 or Category 3 on SFP+ SR/DA 10GBase-KR and