Dell Intel PRO Family of Adapters - Manual (Page 148)

l CE - EMC Directive (89/336/EEC) (European Union)
l VCCI - Radiated & Conducted Emissions (Japan)
l CNS13438 - Radiated & Conducted Emissions (Taiwan)
l AS/NZS3548 - Radiated & Conducted Emissions (Australia/New Zealand)
l MIC notice 1997-41, EMI and MIC notice 1997-42 - EMS (Korea)
Intel® Gigabit Network Mezzanine Card Specifications
Feature Intel® Gigabit ET Quad Port Mezzanine Card Intel® Gigabit 4P I350-t Mezz
Bus Connector PCI Express 2.0 PCI Express 2.0
Bus Speed 2 x4 x4
Power Requirements 4.9 Watts (maximum) @ 3.3 V 3.425 Watts (maximum) @ 3.3 V
Dimensions 3.5 x 3.3 in. 3.65 x 3.3 in.
Operating Temperature 32 - 131 deg. F (0 - 55 deg. C) 32 - 131 deg. F (0 - 55 deg. C)
MTBF 51 years 108 years
Available Speeds Full only at 1000 Mbps Full only at 1000 Mbps
Duplex Modes Full at 1000 Mbps Full at 1000 Mbps
Standards Conformance IEEE 802.1p
IEEE 802.1Q
IEEE 802.3ab
IEEE 802.3ac
IEEE 802.3ad
IEEE 802.3x
ACPI v1.0
PCI Express 2.0 IEEE 802.1p
IEEE 802.1Q
IEEE 802.3ab
IEEE 802.3ac
IEEE 802.3ad
IEEE 802.3x
ACPI v1.0
PCI Express 2.0
Regulatory and Safety Safety Compliance
l UL 60950 Third Edition- CAN/CSA-C22.2 No.60950-00 (USA/Canada)
l EN 60 950 (European Union)
l IEC 60 950 (International)
EMC Compliance
l FCC Part 15 - Radiated & Conducted Emissions (USA)
l ICES-003 - Radiated & Conducted Emissions (Canada)
l CISPR 22 - Radiated & Conducted Emissions (International)
l EN55022-1998 - Radiated & Conducted Emissions (European Union)
l EN55024 - 1998 - (Immunity) (European Union)
l CE - EMC Directive (89/336/EEC) (European Union)
l VCCI - Radiated & Conducted Emissions (Japan)
l CNS13438 - Radiated & Conducted Emissions (Taiwan)
l AS/NZS3548 - Radiated & Conducted Emissions (Australia/New Zealand)
l MIC notice 1997-41, EMI and MIC notice 1997-42 - EMS (Korea)