HP 441877-00B - Manual (Page 169)

Diagnostics 169
• B3. RXP scratchpad
• B4. COM scratchpad
• B5. CP scratchpad
• B6. MCP scratchpad
• B7. TAS header buffer
• B8. TAS payload buffer
• B9. RBUF via GRC
• B10. RBUF via indirect access
• B11. RBUF Cluster list
• B12. TSCH list
• B13. CSCH List
• B14. RV2P scratchpads
• B15. TBDC memory
• B16. RBDC memory
• B17. CTX page table
• B18. CTX memory
Group C: Block tests
• C1. CPU logic and DMA interface tests
The tests check the basic logic functionalities of each of the on-chip CPUs. The tests also cover the
DMA interface exposed to the CPUs. These tests require the presence of a test firmware file inside
the “diagfw” directory.
• C2. RBUF allocation test
This tests the Rx buffer allocation interface.
• C3. CAM access test
This tests read, write, add, modify, and cache hit functionalities of the associative memory.
• C4. TPAT cracker test
This tests the packet cracking logic block as well as the checksum/CRC offload logic. This test
requires the presence of a test firmware file inside the “diagfw” directory.
• C5. FIO register test
This is another register test dedicated for register interface only exposed to the internal CPUs. This
test requires the presence of the test firmware files in the “diagfw” directory.
• C6. NVM access and reset-corruption tests
This tests the non-volatile memory access (both read and write). It also tests for appropriate access
arbitration among multiple entities (CPUs). Another test is to check to issue chip reset while NVM
block is servicing data to look for any NVM data corruption. This test requires the presence of a test
firmware file inside the “diagfw” directory.
• C7. Core-reset integrity test