Sundance SMT370v2 - Manual (Page 28)

Version 2.0 Page 28 of 46 SMT370v2/v3 User Manual
Operating conditions.
Safety
The module presents no hazard to the user.
EMC
The module is designed to operate within an enclosed host system that provides
adequate EMC shielding. Operation within the EU EMC guidelines is only guaranteed
when the module is installed within an appropriate host system.
The module is protected from damage by fast voltage transients introduced along
output cables from outside the host system. Short-circuiting any output to ground
does not cause the host PC system to lock up or reboot.
General Requirements
The module must be fixed to a TIM40-compliant carrier board.
The SMT370 module is in a range of modules that must be supplied with a 3.3v
power source. In addition to the 5v supply specified in the TIM specification, these
new generation modules require an additional 3.3v supply to be presented on the two
diagonally opposite TIM mounting holes. The lack of this 3.3v power supply should
not damage the module, although it will obviously be inoperable; prolonged operation
under these circumstances is not recommended.
The SMT370 is compatible with all Sundance TIM carrier boards. It is a 5v tolerant
module, and as such, it may be used in mixed systems with older TIM modules,
carrier boards and I/O modules. It is anyway recommended to use the SMT370
connected to an SHB TIM module such as SMT365 or SMT365E in order to get
better transfer performance.
The external ambient temperature must remain between 0
°C and 40°C, and the
relative humidity must not exceed 95% (non-condensing).
Power Consumption
The power consumption of this TIM is dependent on the operating conditions in terms
of core activity and I/O activity. The maximum power consumption is 10W.
Temperature
This test has been performed in an ambient temperature of 28 degrees C, in an
open-case standard PC. The board was configured in Pattern generator mode and
running full speed, i.e. ADCs at 105 MHz with input signal full scale and the DAC at
400 MSPS (50 MHz and interpolation 8):
- FPGA: 52 degrees,
- Top metal case: 51 degrees,
- Bottom board: 68 degrees.