13 interface description, 1 mechanical interface, 2 electrical interface – Sundance SMT329 User Manual

Page 44: Interface description, Mechanical interface, Electrical interface

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4.13 Interface Description


4.13.1 Mechanical Interface

The board conforms to the VME standard for a ‘Double Height’ board. This is:
160.0 (+0, -0.3) mm by 233.35 (+0, -0.3) mm.
The board occupies 1 or 2 VME slots depending on the height of the TIM modules fitted.
The SMT329 board layout is similar SMT328. To aid routing the top 2 TIM sites have been
rotated together through 180 degrees.
The VME P0 connector present on the VXS version of the SMT329, was not present on
SMT328.
The front panel comm port connectors on SMT328 have been removed.



4.13.2 Electrical Interface

The VME64 bus interface is through the standard 160 way DIN back plane connectors,
designated P1 and P2: Harting 02 01 160 1101.

The VXS bus interface is through the standard 105 way metric back plane connector
designated P0: Tyco 1410147-2.
TIMs 1,2,3,4 are each interfaced through TIM-40 connectors J1 and J2: Hirose FX4C-80S-
1.27DSA.
TIMs 1 and 4 are additionally interfaced through TIM-40 connector J3: Hirose FX4C-80S-
1.27DSA.
JTAGIN (J27) and JTAGOUT (J28) are each interfaced through 3M 20 way mini “D”
connectors: N10220-5212PC.
Xilinx programming header LK1 is a 0.1 inch pitch 6 way gold plated pin header.

User Manual SMT329

Page 44 of 52 Last

Edited:

09/02/2007

10:58:00

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