Lanner LEC-7950 - Manual (Page 18)

17
Hardware Setup
Chapter 4
Embedded and Industrial Computing
Note:
The motherboards can support up to 16 GB 1.
memory capacity in maximum.
The system supports DDR3 2.
1066/1333/1600MHz SO-DIMM. Do not install
memory module with different specifications.
Chapter 4:
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from the
server. The front panel Power On/Standby button
does not completely shut off system power.
Portions of the power supply and some internal
circuitry remain active until AC power is removed.
Unpower the LEC-7950 and remove the power cord. 1.
Unscrew the 4 rubber feet from the bottom cover of 2.
the LEC-7950 System.
Open the cover. 3.
Note: In order to take off the bottom cover, you will
also need to take off the CF/SIM card protection
cover first.
Installing the System Memory
The motherboard supports DDR3 memory to meet the
higher bandwidth requirement of the latest operating
system and Internet applications. It comes with two
double data rate type three (DDR3) small outline dual in-
line memory module (SO-DIMM) sockets.
1
2