Package and pinout information, 1 package information – Intel GD82559ER User Manual
Page 91
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Datasheet
85
Networking Silicon — GD82559ER
12.
Package and Pinout Information
12.1
Package Information
The GD82559ER is a 196-pin Ball Grid Array (BGA) package. Package dimensions are shown in
Figure 24
. More information on Intel device packaging is available in the Intel Packaging
Handbook, which is available from the Intel Literature Center or your local Intel sales office.
Figure 24. Dimension Diagram for the GD82559ER 196-Pin BGA
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