ADLINK cPCI-6510 - Manual (Page 27)

Specifications 13
cPCI-6510
2.4 Thermal Requirements
This section provides information on the thermal requirements of
the cPCI-6510 Series. Cooling of the board and its components is
provided by the thermal module (passive heatsink) and is depen-
dent on sufficient airflow from the chassis.
The amount of thermal energy that can by dissipated from the
board is dependent on the ambient air temperature and the airflow
rate of the chassis. To provide the user with guidelines for the
upper limits of operating conditions for the cPCI-6510, the follow-
ing sections give information on the maximum ambient air temper-
ature as a function of airflow rate for a given level of power
consumption.
Power Dissipation Graphs
The graphs shown below illustrate the level of CPU power dissipa-
tion that can be maintained dependent on ambient air temperature
and airflow rate. One graph is provided for each CPU supported
by the cPCI-6510. The curves on each graph indicate the upper
limits of operating conditions under which the CPU will not be
affected by its thermal management and protection systems at a
given percentage of the CPU’s thermal design power (TDP).
The CPU’s thermal management and protection systems begin to
take effect when the CPU temperature exceeds the maximum
junction temperature (T
j,Max
=105°C). When the ambient air tem-
perature and airflow rate are in the ranges below the TDP curves
on the graphs, the CPU temperature will remain below T
j,Max
and
the CPU will be able to operate at full performance (i.e. not limited
by thermal management).
The power dissipation graphs show two curves:
X
100% TDP
X
75% TDP
The detailed specifications for each processor can be found in
Section 3.1 "Processor" on page 17.