Document Outline

• SECTION 1 INTRODUCTION
  • 1.1 CAPABILITIES
  • 1.2 USER FEATURES
  • 1.3 CONTROLS
    • FRONT PANEL
    • REAR PANEL
    • POWER SUPPLY CONNECTION
    • CELL CONNECTION
    • RS232 CONNECTION
    • EXTERNAL TEMPERATURE CONNECTION
    • CE COMPLIANCE
• SECTION 2 GETTING STARTED
  • 2.1 UNPACKING
  • 2.2 WARRANTY CARD
  • WHAT YOU NEED
  • 2.4 SETTING UP
    • 1. Power
      • 2. Set the Date and Time
        • 3. Connect the Cell
        • 4. Configure the 3200
        • 5. Measurement
• SECTION 3 SYSTEM CONFIGURATION AND OPERATION
  • 3.1 MENU
  • 3.2 CELL CALIBRATION
    • CONFIGURE
    • CAL K
      • Single Point
      • Multi Point
      • Offset
      • Send
  • 3.3 TEMPERATURE COMPENSATION
    • TEMP
      • Linear Temperature Compensation
      • Non-linear Temperature Compensation
      • Send
  • 3.4 PLATINIZATION
  • 3.5 DISPLAY CONFIGURATION
    • MEASUREMENT UNITS
    • CONTRAST
    • TIME/DATE
    • ALARMS
    • BEEPER
    • RANGING
  • 3.6 MAKING MEASUREMENTS
• SECTION 4 DATA STORAGE AND RETRIEVAL
  • 4.1 STORE
  • 4.2 REVIEW
    • RECALL
    • SEND ALL
    • CLEAR
    • CLEAR ALL
  • 4.3 SEND
    • SEND SETUP
    • DATA LOGGING
• SECTION 5 DIAGNOSTICS
  • 5.1 SEND
  • 5.2 BEEP
• SECTION 6 MAINTENANCE
  • 6.1 CELL CLEANING AND STORAGE
    • To clean a conductivity cell:
      • Storage
  • 6.2 PLATINIZATION
• SECTION 7 TROUBLESHOOTING
  • 7.1 ERROR MESSAGES
• SECTION 8 PRINCIPLES OF OPERATION
  • 8.1 RATIOMETRIC CONDUCTIVITY
  • 8.2 CONDUCTIVITY PRINCIPLES
    • INTRODUCTION
    • CONDUCTIVITY FUNDAMENTALS
    • CELL CONSTANT
    • CHOOSING A CONDUCTIVITY CELL
    • CELL CONSTANT CALCULATION
    • CONDUCTIVITY CELL CALIBRATION - SOME THINGS TO REMEMBER
    • CONDUCTIVITY LAW
    • LOW CONDUCTIVITY MEASUREMENTS
      • Error Sources
    • GENERAL CONDUCTIVITY MEASUREMENT PRECAUTIONS
    • PLATINIZATION
      • Platinum Black Inspection
      • Replatinizing
    • TEMPERATURE CORRECTION
      • Prestored Temperature Compensation Curves
      • Determining The Temperature Coefficient
    • SMALL SAMPLE MEASUREMENTS
    • CONDUCTIVITY SYSTEM ACCURACY CONSIDERATIONS
      • Instrument Accuracy
      • Cell-Constant Accuracy
      • Temperature Accuracy
  • 8.3 SALINITY
  • 8.4 TOTAL DISSOLVED SOLIDS
  • 8.5 TEMPERATURE
  • 8.6 SOURCES OF ERRORS
    • CELL CONTAMINATION
    • CELL PLATINIZING
    • ELECTRICAL-NOISE ERRORS
    • CONTACT RESISTANCE
    • CABLE SERIES RESISTANCE AND SHUNT CAPACITANCE
    • GALVANIC AND MISCELLANEOUS EFFECTS
• SECTION 9 WARRANTY AND REPAIR
  • AUTHORIZED U.S. SERVICE CENTERS
    • FOR THE NEAREST AUTHORIZED SERVICE CENTER, CONTACT:
    • CLEANING INSTRUCTIONS
  • PACKING INSTRUCTIONS
  • 9.1 SOFTWARE UPGRADE PROCEDURE
  • 9.2 DISASSEMBLY/ASSEMBLY PROCEDURES
    • Case Disassembly
      • PC Board Removal
      • PC Board Re-installation
      • Case Re-assembly
  • 9.3 TEST AND VERIFICATION PROCEDURE
• SECTION 10 ACCESSORIES AND REPLACEMENT PARTS
  • 10.1 YSI CONDUCTIVITY CELLS
  • 10.2 STANDARD CALIBRATOR SOLUTIONS
• APPENDIX A - SPECIFICATIONS
• APPENDIX B REQUIRED NOTICE
• APPENDIX C - RS232 CONNECTIONS
  • Serial Printer Connection
    • Serial Computer Connection
• APPENDIX D TEMPERATURE CORRECTION DATA FOR
• TYPICAL SOLUTIONS
• APPENDIX E - CONVERSION FACTORS
• APPENDIX F - GLOSSARY OF TERMS