National Instruments Graphical User Interface Ultiboard User Manual
Page 161
Chapter 5
Working with Traces and Copper
© National Instruments Corporation
5-17
3.
In the Autorouter Settings box, select either Via is Fixed or Via can
be Moved (during autorouting).
4.
In the Solder Mask box, select the following as desired:
•
Top checkbox—Enable to place a solder mask on the top of the
PCB.
•
Bottom checkbox—Enable to place a solder mask on the bottom
of the PCB.
If the via that you have selected is a micro via, the Micro Via tab displays
instead of the Via tab.
Complete the following steps to change the settings in the Micro Via tab:
1.
Enable the Assume net checkbox to assign a specific net to the micro
via, then select the net from the drop-down list.
2.
In the Autorouter Settings box, select either Via is Fixed or Via can
be Moved (during autorouting).
3.
In the Solder Mask box, select the following as desired:
•
Top checkbox—Enable to place a solder mask on the top of the
PCB.
•
Bottom checkbox—Enable to place a solder mask on the bottom
of the PCB.
4.
In the Via Settings box, set the following as desired:
•
Use Design Rules radio button—Select to use the settings in the
Pads/Vias tab of the PCB Properties dialog box.
•
Pad Diameter radio button—Select to enter the diameter of the
selected via’s pad in the drop-down list. The Landing Pad and
Drill Diameter drop-down lists are also activated; enter the
desired values in these.
5.
In the Layer Settings list, enable which layers to Allow Autorouting.
Complete the following steps to change the settings in the Thermal Relief
tab:
1.
Set the width of the thermal relief’s spokes in the Spoke Width area.
2.
Enable the desired radio button in the Type area to se the shape of the
thermal relief. If you do not wish to use thermal relief for the via, select
No thermal relief.