Intel Itanium 2 Processor - Manual (Page 3)

Datasheet 3
Contents
1 Introduction....................................................................................................................... 11
1.1 Overview ............................................................................................................. 11
1.2 Processor Abstraction Layer ............................................................................... 11
1.3 Mixing Processors of Different Frequencies and Cache Sizes ........................... 12
1.4 Terminology......................................................................................................... 12
1.5 State of Data ....................................................................................................... 12
1.6 Reference Documents......................................................................................... 13
2 Electrical Specifications.................................................................................................... 15
2.1 Itanium
®
2 Processor System Bus ...................................................................... 15
2.1.1 System Bus Power Pins ......................................................................... 15
2.1.2 System Bus No Connect ........................................................................ 15
2.2 System Bus Signals ............................................................................................ 15
2.2.1
Signal Groups......................................................................................... 15
2.2.2 Signal Descriptions................................................................................. 16
2.3 Package Specifications ....................................................................................... 17
2.4 Signal Specifications ........................................................................................... 18
2.4.1
Maximum Ratings................................................................................... 22
2.5 System Bus Signal Quality Specifications and Measurement Guidelines........... 23
2.5.1
Overshoot/Undershoot Magnitude ......................................................... 23
2.5.2 Overshoot/Undershoot Pulse Duration................................................... 24
2.5.3 Activity Factor......................................................................................... 24
2.5.4 Reading Overshoot/Undershoot Specification Tables............................ 25
2.5.5 Determining if a System Meets the Overshoot/Undershoot
Specifications ......................................................................................... 25
2.5.6 Wired-OR Signals................................................................................... 28
2.6 Power Pod Connector Signals ............................................................................ 30
2.7 Itanium
®
2 Processor System Bus Clock and Processor Clocking ..................... 32
2.8 Recommended Connections for Unused Pins .................................................... 35
3 Pinout Specifications ........................................................................................................ 37
4 Mechanical Specifications ................................................................................................ 69
4.1 Mechanical Dimensions ...................................................................................... 69
4.2 Package Marking................................................................................................. 72
4.2.1
Processor Top-Side Marking.................................................................. 72
4.2.2 Processor Bottom-Side Marking............................................................. 72
5 Thermal Specifications ..................................................................................................... 75
5.1 Thermal Features ................................................................................................ 75
5.1.1
Thermal Alert.......................................................................................... 75
5.1.2 Enhanced Thermal Management ........................................................... 76
5.1.3 Thermal Trip ........................................................................................... 76
5.2 Case Temperature .............................................................................................. 76
6 System Management Feature Specifications................................................................... 79
6.1 System Management Bus ................................................................................... 79
6.1.1
System Management Bus Interface ....................................................... 79
6.1.2 System Management Interface Signals.................................................. 79