NXP Semiconductors PCA9665 - Manual (Page 91)

NXP Semiconductors
PCA9665
Fm+ parallel bus to I 2 C-bus controller
© NXP B.V. 2006. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 December 2006
Document identifier: PCA9665_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12 Static characteristics. . . . . . . . . . . . . . . . . . . . 70
13 Dynamic characteristics . . . . . . . . . . . . . . . . . 71
14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 78
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 79
16 Handling information. . . . . . . . . . . . . . . . . . . . 83
17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 83
17.2 Through-hole mount packages . . . . . . . . . . . . 83
17.2.1 Soldering by dipping or by solder wave . . . . . 83
17.2.2 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 83
17.3 Surface mount packages . . . . . . . . . . . . . . . . 83
17.3.1 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 83
17.3.2 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 85
17.3.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 85
17.4 Package related soldering information . . . . . . 85
18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 87
19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 87
20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 89
20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 89
20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
21 Contact information. . . . . . . . . . . . . . . . . . . . . 89
22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90