Cirrus Logic CS4271 - Manual (Page 46)

CS4271
46 DS592F1
10.PACKAGE DIMENSIONS
Notes: 1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not
reduce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS AND SPECIFICATIONS
Notes: 4. θ
JA
is specified according to JEDEC specifications for multi-layer PCBs.
INCHES MILLIMETERS NOTE
DIM MIN NOM MAX MIN NOM MAX
A -- -- 0.47 -- -- 1.20
A1 0.002 0.004 0.006 0.05 0.10 0.15
A2 0.03150 0.035 0.04 0.80 0.90 1.00
b 0.00748 0.0096 0.012 0.19 0.245 0.30 2,3
D 0.378 BSC 0.382 BSC 0.386 BSC 9.60 BSC 9.70 BSC 9.80 BSC 1
E 0.248 0.2519 0.256 6.30 6.40 6.50
E1 0.169 0.1732 0.177 4.30 4.40 4.50 1
e -- 0.026 BSC -- -- 0.65 BSC --
L 0.020 0.024 0.029 0.50 0.60 0.75
∝
0° 4° 8° 0° 4° 8°
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Parameters Symbol Min Typ Max Units
Package Thermal Resistance (Note 4) 28-TSSOP θ
JA
θ
JC
-
- 37
13 -
- °C/Watt
°C/Watt
Allowable Junction Temperature - - 135
°C
28L TSSOP (4.4 mm BODY) PACKAGE DRAWING
E
N
1 2 3
e b 2
A1
A2 A
D
SEATING
PLANE
E1 1
L
SIDE VIEW
END VIEW
TOP VIEW
∝