Cypress enCoRe CY7C63310 User Manual
Page 5
CY7C63310, CY7C638xx
Document 38-08035 Rev. *K
Page 5 of 83
Figure 5-2. CY7C63823 Die Form
Die step = 1792.98 μm x 2272.998 μm
Die size = 1727 μm x 2187 μm
Bond pad opening = 70 μm x 70 μm
Die thickness = 14 mils
Legend
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Cypress Logo
X
Y
Table 5-1. Die Pad Summary
Pad Number
Pad Name
X (microns)
Y (microns)
1
P0.7
-742.730
911.990
2
P0.6
-755.060
792.200
3
P0.5
-755.060
699.300
4
P0.4
-755.060
606.400
5
P0.3
-755.060
-430.080
6
P0.2
-755.060
-522.980
7
P0.1
-755.060
-618.830
8
P0.0 CLKIN
-755.060
-714.020
9
P2.1
-755.060
-810.220
10
P2.0
-393.580
-977.930
11
VSS
537.500
-964.700
12
PI.0 D+
736.110
-936.680
13
P1.1 D–
736.110
-625.130
14
VDD
736.110
-260.670
15
P1.2 VREG
736.110
53.800
16
P1.3
723.510
336.780
17
P3.0
723.510
438.690
18
P3.1
723.510
532.880
19
P1.4
723.510
635.310
20
P1.5 SMOSI
723.510
728.220
21
P1.6 SMISO
723.510
839.290
22
P1.7
696.630
1008.480
23
Reserved
-795.400
1023.270