Cypress enCoRe CY7C63310 - Manual (Page 76)

CY7C63310, CY7C638xx
Document 38-08035 Rev. *K Page 76 of 83
31. Package Diagrams
Figure 31-1. 16-Pin (300-Mil) Molded DIP P1
Figure 31-2. 16-Pin (150-Mil) SOIC S16.15
DIMENSIONS IN INCHES MIN.
MAX.
SEATING PLANE
0.240
0.260
0.015
0.035
0.740
0.770
0.120
0.140
0.015
0.060
0.015
0.020
0.055
0.065
0.140
0.190
0.090
0.110
0.280
0.325
0.009
0.012
0.310
0.385
0.115
0.160
3° MIN.
1 8
9 16
51-85009 *A
PIN 1 ID
0°~8°
1 8
9 16
SEATING PLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254]
X 45°
0.004[0.102]
REFERENCE JEDEC MS-012
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
PACKAGE WEIGHT 0.15gms
51-85068-*B
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