Technical specifications - frame – TC Electronic DB8 MKII User Manual

Page 48

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48

TeCHnICal speCIfICaTIOns - frame

Platform

Number of audio channels:

Number of processing engines:

Processing Delay:

Additional delay:

Output Dither:

Frequency Response DIO:

Internal sample rate:

Internal clock precision:

Jitter rejection at external sample rates:

Rejection filter (4th order):

Rejection filter peak (jitter gain):

PCMCIA Interface

Connector:

Standards:

Card Format:

Control Interface

MIDI:

“GPI control input”

Remote:

SMPTE:

Ethernet, SNMP and remote control:

EMC

Complies with:

Safety

Certified to:

Environment

Operating Temperature:

Storage Temperature:

Humidity:

General

Front indicators:

Finish:

Dimensions:

Weight:

Mains voltage:

Power supply function:

Fan:

Power consumption:

Backup Battery Life:

Warranty, Parts and labor:

IO configurations

AES balanced

Number of audio channels:

Connectors:

Formats:

Word clock input:

Intrinsic interface jitter :

Digital output phase:

Input variation before sample slip:

Interface function:

AES3-id unbalanced

Number of audio channels:

Connectors:

Bypass Relay:

Formats:

Word clock input:

Intrinsic interface jitter:

Digital output phase:

Input variation before sample slip:

Interface function:

SDI

Number of audio channels:

Connectors:

Bypass Relay:

Function:

Formats supported:

Input selection:

Outputs:

Audio embed + de-embed delay:

Video delay:

Interface function:

Max 16 inputs, 16 outputs

4 in DB8, 2 in DB4

0.15 ms + 0.21 ms per engine @ 48 kHz, 0.07 ms

0-4 sec per audio channel

HPF/TPDF 8-24 bit and Off

DC to 23.9 kHz ± 0.01 dB @ 48 kHz

48.0 kHz, 44.1 kHz

+/- 30 ppm

42.5 to 45.5 kHz, 46.5 to 48.5 kHz

< -3 dB @ 50 Hz, < -65 dB @ 500 Hz, < -100 dB @ 1.4 kHz

< 1 dB @ 2 Hz

PC Card, 68 pin type 1 cards

PCMCIA 2.0, JEIDA 4.0

Supports up to 2 MB SRAM

In/Out/Thru: 5 Pin DIN

Change between 2, 4 or 8 presets

Custom MIDI In & Out

Input for timed program changes

10/100 Mbits/s, Base-T

EN 55103-1 and EN 55103-2, FCC part 15 class B, CISPR 22 class B

IEC 60065, EN 60065, UL 6500 and CSA E65

32° F to 122° F (0° C to 50° C)

-22° F to 167° F (-30° C to 70° C)

Max. 90 % non-condensing

PSU 1 OK, PSU 2 OK, Remote Communication

Natural color anodized aluminum face plate. Painted and plated steel chassis

19 x 3.5 x 12 inches (483 x 89 x 305 mm), 2 RU

19 lbs. (8,6 kg)

100 to 240 VAC, 50-60 Hz auto-select

Dual Power Supply Redundancy

Dual Fan Redundancy

25 to 50 W typ., 60 W max, depending on I/O configuration

>10 years

1 year

8 channel In, 8 channel Out

SUB-D, 25 pole, 110 Ohm, AES/EBU in/out

AES/EBU (24 bit)

BNC, 75 Ohm or Hi-Z, 0.6 to 10 Vpp

< 1 ns peak, BW : 700 Hz to 100 kHz

Less than 3% of sample period

+27 % / -73 % of sample period

Synchronous, bit transparent

8 channel In, 8 channel Out

BNC, 75 Ohm, 0.1 to 10 Vpp, AES3-id in/out

Inputs to outputs while powered off and during boot-up

AES/EBU (24 bit)

BNC, 75 Ohm or Hi-Z, 0.6 to 10 Vpp

< 1 ns peak, BW : 700 Hz to 100 kHz

< 3 % of sample period

+27 % / -73 % of sample period

Synchronous, bit transparent

8 channel In, 8 channel Out

2 BNC In, 2 BNC Out. 75 Ohm

Input B to output while powered off and during boot-up

Audio de-embed/embed, video thru

SD and HD. 143 - 1485 MHz

Input 1 or 2, SDI group 1-4

2 is a replicate of 1. Outputs are individually buffered.

1.77 ms @ SD, 0.83 ms @ HD

22.3 us @ SD, 15.4us @ HD

Synchronous, bit transparent video and audio

Technical

Specifications

are subject to change without

notice

!

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