Altera PowerPlay Early Power Estimator User Manual

Page 34

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3–22

Chapter 3: Using Cyclone III PowerPlay Early Power Estimator

Power Analysis

PowerPlay Early Power Estimator User Guide for Cyclone III FPGAs

© June 2009 Altera Corporation

If you want the PowerPlay Early Power Estimator thermal model to take the 

JABOTTOM

thermal resistance into consideration, set the Board Thermal Model to either Typical
Board

or JEDEC (2s2p). If you do not want the PowerPlay Early Power Estimator

thermal model to take the 

JA BOTTOM

resistance into consideration, set the Board

Thermal Model

to None (conservative). In this case, the path through the board is not

considered for power dissipation and a more conservative thermal power estimate is
obtained.

The 

JA TOP

is determined by the sum of the junction-to-case thermal resistance (

JC

), the

case-to-heat sink thermal resistance (

CS

), and the heat sink-to ambient thermal

resistance (

SA

):

JA TOP

= 

JC

+ 

CS

+ 

SA

Based on the device, package, airflow, and heat sink solution selected in the main
input parameters, the PowerPlay Early Power Estimator determines the 
junction-to-ambient thermal resistance (

JA TOP

).

If you are using a low, medium, or high profile heat sink, select the airflow from the
options of still air and airflow rates of 100 lfm (0.5 m/s), 200 lfm (1.0 m/s), and
400-lfm (2.0 m/s). If you are using a custom heat sink, enter the heat sink-to-ambient
thermal resistance (

SA

). The airflow should also be incorporated into 

SA

. Therefore,

the Airflow parameter is not applicable in this case. Obtain these values from the heat
sink manufacturer.

The ambient temperature does not change, but the junction temperature changes
depending on the thermal properties. Since a change in junction temperature affects
the thermal device properties used to calculate junction temperature, calculating
junction temperature is an iterative process.

The total power is calculated based on the total 

JA

, ambient temperature, and junction

temperature using

Equation 3–3

.

Figure 3–18

shows the thermal analysis, including the junction temperature (T

J

), total

JA

, and the maximum allowed T

A

values. For details on the values of the thermal

parameters not listed, click the Details button.

Equation 3–3. Total Power Calculation Using a Heat Sink

Figure 3–18. Thermal Analysis in the PowerPlay Early Power Estimator

P

TJ TA

JA

-----------------------

=

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