Chapter 3 – DFI CR902-B User Manual

Page 23

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Chapter 3 Hardware Installation

23

Chapter 3

Signal

Pin#

Pin Type

Pwr Rail /Tolerance

PU/PD

Description

LVDS_A0+

A71

LVDS_A0-

A72

LVDS_A1+

A73

LVDS_A1-

A74

LVDS_A2+

A75

LVDS_A2-

A76

LVDS_A3+

A78

LVDS_A3-

A79

LVDS_A_CK+

A81

LVDS_A_CK-

A82

LVDS_B0+

B71

LVDS_B0-

B72

LVDS_B1+

B73

LVDS_B1-

B74

LVDS_B2+

B75

LVDS_B2-

B76

LVDS_B3+

B77

LVDS_B3-

B78

LVDS_B_CK+

B81

LVDS_B_CK-

B82

LVDS_VDD_EN

A77

O CMOS

3.3V / 3.3V

PD 100K: to GND

LVDS panel power enable

LVDS_BKLT_EN

B79

O CMOS

3.3V / 3.3V

PD 100K: to GND

LVDS panel backlight enable

LVDS_BKLT_CTRL B83

O CMOS

3.3V / 3.3V

PD 100K: to GND

LVDS panel backlight brightness control

LVDS_I2C_CK

A83

I/O OD CMOS 3.3V / 3.3V

PU 2.2K: to 3.3V

I2C clock output for LVDS display use

LVDS_I2C_DAT

A84

I/O OD CMOS 3.3V / 3.3V

PU 2.2K: to 3.3V

I2C data line for LVDS display use

Signal

Pin#

Pin Type

Pwr Rail /Tolerance

PU/PD

Description

LPC_AD0

B4

LPC_AD1

B5

LPC_AD2

B6

LPC_AD3

B7

LPC_FRAME#

B3

O CMOS

3.3V / 3.3V

LPC frame indicates the start of an LPC cycle

LPC_DRQ0#

B8

LPC_DRQ1#

B9

LPC_SERIRQ

A50

I/O CMOS

3.3V / 3.3V

PU 10K: to 3.3V

LPC serial interrupt

LPC_CLK

B10

O CMOS

3.3V / 3.3V

LPC clock output - 33MHz nominal

Signal

Pin#

Pin Type

Pwr Rail /Tolerance

PU/PD

Description

SPI_CS#

B97

O CMOS

3.3V Suspend/3.3V

Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1

SPI_MISO

A92

I CMOS

3.3V Suspend/3.3V

Data in to Module from Carrier SPI

SPI_MOSI

A95

O CMOS

3.3V Suspend/3.3V

Data out from Module to Carrier SPI

SPI_CLK

A94

O CMOS

3.3V Suspend/3.3V

Clock from Module to Carrier SPI

SPI_POWER

A91

O

3.3V Suspend/3.3V

Power supply for Carrier Board SPI – sourced from Module – nominally
3.3V. The Module shall provide a minimum of 100mA on SPI_POWER.
Carriers shall use less than 100mA of SPI_POWER. SPI_POWER
shall only be used to power SPI devices on the Carrier

BIOS_DIS0#

A34

BIOS_DIS1#

B88

I CMOS

3.3V / 3.3V

LPC serial DMA request

SPI Signals Descriptions

I CMOS

NA

Selection straps to determine the BIOS boot device.
The Carrier should only float these or pull them low, please refer to
COM Express Module Base Specification Revision 2.1 for strapping options of BIOS disable signals.

I/O CMOS

3.3V / 3.3V

LPC multiplexed address, command and data bus

LVDS Channel A differential clock

O LVDS

LVDS

LVDS Channel B differential pairs

O LVDS

LVDS

O LVDS

LVDS

O LVDS

LVDS

O LVDS

LVDS

O LVDS

LVDS

LVDS Channel B differential clock

LPC Signals Descriptions

LVDS Signals Descriptions

O LVDS

LVDS

LVDS Channel A differential pairs

O LVDS

LVDS

O LVDS

LVDS

O LVDS

LVDS

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