Intel SE8500HW4 - Manual (Page 80)

Mechanical and Thermal Specifications Intel® Server Board Set SE8500HW4
Revision 1.0
Intel order number D22893-001
68
9.2 Thermal Specifications
Table 38. Thermal Specifications
Component Target Velocity Target Ambient Temp Specification
Processors See Processors Thermal Specifications
Sockets 400 lfm 50 °C 100 °C, T
socket
Cache VRD 400 lfm 50 °C 90°C, T
sink
@ MAX
Core VRD 400 lfm 50 °C 90°C, T
sink
@ MAX
North Bridge 400 lfm 50 °C 105 °C, THIS
PXH 400 lfm 50 °C 105 °C, T
die
XMB 400 lfm 50 °C 105 °C, T
case
Intel® IOP332 Storage I/O
Processor 400 lfm 50 °C 105 °C, T
die
ICH5 400 lfm 50 °C 85 °C, T
case
LSI* 53C1030 SCSI 400 lfm 50 °C 85 °C, T
case
ATI* Radeon* 7000 Video 400 lfm 50 °C 85 °C, T
case
Broadcom* BCM5704 Ethernet 400 lfm 50 °C 105 °C, T
die
DDR2 400MHz RAID DIMM 400 lfm 50 °C 85 °C, T
case
Mainboard 400 lfm 50 °C 100 °C, T
board