Intel CELERON 200 - Manual (Page 18)

Processor Thermal/Mechanical Information
18 Thermal and Mechanical Design Guidelines
Figure 4. Vertical Lock-Down Alignment Feature
Figure 5. Various Types of Solder Crack
2.2 Thermal Requirements
The processor requires a thermal solution to maintain temperatures within operating
limits. Refer to the datasheet for the processor thermal specifications.
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should remain within the minimum
and maximum junction temperature specifications at corresponding thermal design
power (TDP) as listed in datasheet.
The thermal limits for the processor are the junction temperature (T
J
). The T
J
defines
the maximum junction temperature as a function of power being dissipated.
Designing to this specification allows optimization of thermal designs for processor
performance.