Intel CELERON 200 - Manual (Page 32)

Thermal Metrology
32 Thermal and Mechanical Design Guidelines
Figure 12. Locations for Measuring Local Ambient Temperature, Passive Heatsink
3MM AWAY FROM HEATSINK SIDES
TOP VIEW
POTISTION THERMOCOUPLES (X4)
AT LOCATIONS AS INDICATED
TO MEASURE T
A
.
TC1
TC2
TC3
TC4
HALF OF HEATSINK FIN HEIGHT
SIDE VIEW
3MM AWAY FROM HEATSINK SIDES
TOP VIEW
POTISTION THERMOCOUPLES (X4)
AT LOCATIONS AS INDICATED
TO MEASURE T
A
.
TC1
TC2
TC3
TC4
HALF OF HEATSINK FIN HEIGHT
SIDE VIEW
NOTE: Drawing Not to Scale
It is recommended that full and routine calibration of temperature measurement
equipment be performed before attempting to perform temperature measurement.
Intel recommends checking the meter probe set against known standards. This
should be done at 0 ºC (using ice bath or other stable temperature source) and at an
elevated temperature, around 80 ºC (using an appropriate temperature source).
Wire gauge and length also should be considered as some less expensive
measurement systems are heavily impacted by impedance. There are numerous
resources available throughout the industry to assist with implementation of proper
controls for thermal measurements.
3.3 Processor Power Measurement Metrology
Recommendation
This section recommends a metrology to measure power consumption of the Intel
Celeron processor 200 sequence on the Intel Desktop Board D201GLY2. Should there
be any modification of motherboard layout or design, contact Intel field sales
representative or product marketing staff for clarification of this metrology.