Intel CELERON 200 - Manual (Page 22)

Processor Thermal/Mechanical Information
22 Thermal and Mechanical Design Guidelines
2.4 System Thermal Solution Considerations
2.4.1 Chassis Thermal Design Capabilities
The reference thermal solution for the Intel Celeron processor 200 sequence on the
Intel Desktop Board D201GLY2 is a passive heatsink design, which requires chassis to
deliver sufficient airflow cooling to ensure stability and reliability of processor. The
maximum allowable heatsink temperature (T
S-TOP-MAX
) is set to 91 °C for
processor to ensure the capability of a chassis in providing sufficient airflow for
processor cooling. T
S-TOP-MAX
is the maximum limit value for heatsink which is similar
to T
CASE-MAX
for lidded processors.
The “usage power consumption” (P
CPU-USAGE
) of the Intel Celeron processor 200
sequence was quantified at maximum of 16 W based on measurement done on Intel ®
Desktop Board D201GLY2 when tested with SYSMark04. The reference thermal
solution for processor is designed at P
CPU-USAGE
for performance & cost optimal
considerations. Do not mistaken P
CPU-USAGE
with processor’s TDP as documented in
datasheet.
Table 3. System Thermal Solution Design Requirement
1. System Thermal Solution Design Requirement Note
3. T
S-TOP-MAX
≤ 91°C 4. 1
NOTE:
1. Based on processor maximum Usage Power Consumption (P
USAGE
) of 16 W measured on
Intel ® Desktop Board D201GLY2 when tested with SYSMark04.
To evaluate the system thermal capability of a given chassis, the system designer is
recommended to conduct in-chassis system thermal test. The data to be collected are
both processor power consumption (P
CPU
) and heatsink temperature (T
S-TOP
) with the
above mentioned processor load at 35 °C external ambient condition. The T
S-SYSTEM
can be estimated using Equation 1. The thermal pass requirement for a given chassis
can be met if T
S-SYSTEM
≤ T
S-TOP-MAX
.
Equation 1 T
S-SYSTEM
= T
A
+ (T
S-TOP
− T
A
)
× 16/P
CPU
≤ T
S-TOP-MAX
= 91°C
2.4.2 Improving Chassis Thermal Performance
The heat generated by components within the chassis must be removed to provide an
adequate operating environment for the processor and all other components in the
system. Moving airflow through the chassis brings in fresh cool air from the external
ambient environment and transports the heat generated by the processor and other
system components out of the system. Therefore, the number, size and relative
position of fans and vents determine the chassis thermal performance, and the
resulting ambient temperature around the processor.
It is particularly important to choose a thermally advantaged chassis for the reference
thermal solution for Intel Celeron processor 200 sequence on the Intel Desktop Board
D201GLY2, which is a passive heatsink design.