4 safety requirements, 5 reference attach mechanism, 1 structural design strategy – Intel CELERON 200 User Manual

Page 41: Safety requirements, Reference attach mechanism, Structural design strategy

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System Thermal/Mechanical Design Information

Thermal and Mechanical Design Guidelines

41

4.4

Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units

that meet the safety standards:

• UL Recognition-approved for flammability at the system level. All mechanical and

thermal enabling components must be a minimum UL94V-2 approved.

• CSA Certification. All mechanical and thermal enabling components must have

CSA certification.

• All components (in particular the heatsink fins) must meet the test requirements

of UL1439 for sharp edges.

• If the International Accessibility Probe specified in IEC 950 can access the moving

parts of the fan, consider adding safety feature so that there is no risk of personal

injury.

4.5

Reference Attach Mechanism

4.5.1

Structural Design Strategy

Structural design strategy for the Intel reference thermal solution is to minimize

upward board deflection during shock.

The design uses a high clip stiffness that resists local board curvature under the

heatsink, and minimizes, in particular, upward board deflection.

4.5.2

Mechanical Interface to the Reference Attach Mechanism

The attach mechanism component (E21952-001) from the Intel Boxed Processor

thermal solution can be used by other 3

rd

party cooling solutions. The attach

mechanism consists of:

• A metal clip that interfaces with the heatsink, see Figure 22 for the component

drawings.

• Heatsink/fan mass ≤ 62 g

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