1 introduction, 1 document goals and scope, 1 importance of thermal management – Intel CELERON 200 User Manual

Page 7: 2 document goals, Introduction, Document goals and scope, Importance of thermal management, Document goals, 1introduction

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Introduction

Thermal and Mechanical Design Guidelines

7

1

Introduction

1.1

Document Goals and Scope

1.1.1

Importance of Thermal Management

The objective of thermal management is to ensure that the temperatures of all

components in a system are maintained within their functional temperature range.

Within this temperature range, a component is expected to meet its specified

performance. Operation outside the functional temperature range can degrade

system performance, cause logic errors or cause component and/or system damage.

Temperatures exceeding the maximum operating limit of a component may result in

irreversible changes in the operating characteristics of this component.

In a system environment, the processor temperature is a function of both system and

component thermal characteristics. The system level thermal constraints consist of

the local ambient air temperature and airflow over the processor as well as the

physical constraints at and above the processor. The processor temperature depends

in particular on the component power dissipation, the processor package thermal

characteristics, and the processor thermal solution.

All of these parameters are affected by the continued push of technology to increase

processor performance levels and packaging density (more transistors). As operating

frequencies increase and packaging size decreases, the power density increases while

the thermal solution space and airflow typically become more constrained or remains

the same within the system. The result is an increased importance on system design

to ensure that thermal design requirements are met for each component, including

the processor, in the system.

1.1.2

Document Goals

Depending on the type of system and the chassis characteristics, new system and

component designs may be required to provide adequate cooling for the processor.

The goal of this document is to provide an understanding of these thermal

characteristics and discuss guidelines for meeting the thermal requirements imposed

on single processor systems using the Intel

®

Celeron

®

processor 200 sequence.

The concepts given in this document are applicable to any system form factor.

Specific examples used will be the Intel enabled reference solution for a system.

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