Intel CELERON 200 - Manual (Page 8)

Introduction
8 Thermal and Mechanical Design Guidelines
1.1.3 Document Scope
This design guide supports the following processors:
• Intel ® Celeron ® Processor 200 sequence applies to the Intel ® Celeron ® processor
220.
In this document the Intel Celeron Processor 200 sequence will be referred to as “the
processor”.
In this document when a reference is made to “the processor” it is intended that this
includes all the processors supported by this document. If needed for clarity, the
specific processor will be listed.
In this document, when a reference is made to “datasheet”, the reader should refer to
the Intel ® Celeron ® Processor 200 Sequence Datasheet. If needed for clarity, the
specific processor datasheet will be referenced.
In this document, when a reference is made to the “the reference design” it is
intended that this includes all reference designs (D16869-001 and D96271-001)
supported by this document. If needed for clarify, the specific reference design will be
listed.
Chapter 2 of this document discusses package thermal mechanical requirements to
design a thermal solution for the Intel Celeron processor 200 sequence in the context
of personal computer applications. Chapter 3 discusses the thermal solution
considerations and metrology recommendations to validate a processor thermal
solution. Chapter 4 gives information on the Intel reference thermal solution for the
processor in a system application.
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the Datasheet for the product
dimensions, thermal power dissipation, and maximum junction temperature. In case
of conflict, the data in the datasheet supersedes any data in this document.