Intel CELERON 200 - Manual (Page 38)

System Thermal/Mechanical Design Information
38 Thermal and Mechanical Design Guidelines
4.2 Environmental Reliability Testing
4.2.1 Structural Reliability Testing
Structural reliability tests consist of unpackaged, board-level vibration and shock tests
of a given thermal solution in the assembled state. The thermal solution should meet
the specified thermal performance targets after these tests are conducted; however,
the test conditions outlined here may differ from your own system requirements.
4.2.1.1 Random Vibration Test Procedure
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 G RMS
Figure 17. Random Vibration PSD
0.001
0.01
0.1
1 10 100 1000
Frequency (Hz)
PSD
(
g
^
2
/H
z
)
3.13GRMS (10 minutes per axis)
5 Hz
500 Hz
(5, 0.01)
(20, 0.02) (500, 0.02)
4.2.1.2 Shock Test Procedure
Recommended performance requirement for a motherboard:
• Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e.,
total 18 drops).
• Profile: 50 G trapezoidal waveform, 170 in/sec minimum velocity change.
• Setup: Mount sample board on test fixture.