Substrate settings, Enww add a new substrate 61 – HP Latex 210 Printer User Manual

Page 65

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background image

Substrate family

Drying

temp.

Curing

temp.

Heating

airflow

Auto-

tracking

(OMAS)

Cutter

Substrat

e-

advance

compens

ation

Input

tension

Vacuum

Self-adhesive

55

110

30

Yes

Yes

0

15

25

Banner

50

110

45

Yes

No

0

15

5

Textile

55

100

45

Yes

No

0

15

20

Film

55

95

30

Yes

Yes

0

15

25

Synthetic paper

50

80

30

Yes

Yes

0

15

40

Paper-aqueous

45

70

30

Yes

Yes

0

15

20

Paper-solvent

50

90

30

Yes

Yes

0

15

25

Low-temperature
substrate

50

80

30

Yes

Yes

0

15

40

Mesh

50

95

30

Yes

Yes

0

15

30

The various settings mentioned above are described below.

Setting

Description

If too low

If too high

Passes

The number of passes specifies
how many times the printheads
will print over the same area of
the substrate.

The amount of ink fired per time
unit is larger and ink has less
time to dry on the substrate. This
may create coalescence and
banding. The boundaries
between passes may be more
visible. However, printing speed
is relatively high.

Colors are vivid, print quality is
high. However, printing speed is
relatively low. A lower curing
temperature is needed,
otherwise the substrate may be
deformed.

Drying temp.

The heat applied in the printing
zone removes water and fixes
the image to the substrate.

Print-quality defects such as
banding, bleeding and
coalescence may occur.

Thermal marks may be seen on
the substrate; they may appear
as vertical bands in some colors.
The substrate may wrinkle on the
platen, causing vertical banding,
ink smears or substrate jams.

Curing temp.

Curing is needed to coalesce the
latex, creating a polymeric film
which acts as a protective layer,
while at the same time removing
the remaining co-solvents from
the print. Curing is vital to
ensure the durability of the
printed images.

The print may emerge not fully
polymerized, so that the ink
smears when rubbed. The print
may appear wet, after printing
or later. You may need to
increase the number of passes to
achieve adequate curing.

The substrate may wrinkle under
the curing module, causing
defects such as blisters or liner
detachment. The substrate
wrinkles may also cause vertical
banding or ink smears at the
beginning of the following plot.

Heating airflow

Airflow helps to remove the
evaporated water from the print
zone and thus allows more
efficient drying.

In general, use the substrate family default value.

ENWW

Add a new substrate

61

Substrate settings

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