HP Latex 210 Printer - Manual (Page 69)

Substrate
family Warm-up
drying
temperat
ure offset
Warm-up
curing
temperat
ure
Warm-up
curing
temperat
ure offset
Cool-
down
drying
temperat
ure
Cool-
down
drying
temperat
ure offset
Cool-
down
curing
temperat
ure
Cool-
down
curing
temperat
ure offset
Minimum
drying
power
Low-temp. 10 80 0 75 0 85 0 0
Mesh 10 85 0 80 0 85 0 0.7
The various settings mentioned above are described below.
Setting Description If too low If too high
Warm-up drying
temperature The base temperature that the
substrate in the print zone must
reach before printing starts. This setting is determined by the RIP. You cannot change it.
Warm-up drying
temperature offset This offset is added to the base
warm-up drying temperature,
and the total is displayed in the
front panel while the printer is
preparing to print. Bleeding or coalescence may
appear in the first 200-300 mm
of the print. A longer time to start printing is
required. Vertical banding or ink
smears may occur.
Warm-up curing
temperature The base temperature that the
substrate in the curing zone must
reach before printing starts. This setting is determined by the printer. You cannot change it.
Warm-up curing
temperature offset This offset is added to the base
warm-up curing temperature,
and the total is displayed in the
front panel while the printer is
preparing to print. The beginning of the print is not
fully dry, or looks oily. Substrate degradation (blisters,
adhesive detachment) at the
beginning of the print.
Cool-down drying
temperature The base temperature at which
the substrate can be under the
drying module without being
damaged. At the end of a job,
the substrate is not stopped until
this temperature is reached. This setting is determined by the printer. You cannot change it.
Cool-down drying
temperature offset This offset is added to the base
cool-down drying temperature. A long time is needed to finish
the print. The substrate at the beginning of
the next print may be damaged,
because it has stopped moving
under too high a temperature.
This case is uncommon.
Cool-down curing
temperature The base temperature at which
the substrate can be under the
curing module without being
damaged. At the end of a job,
the substrate is not stopped until
this temperature is reached. This setting is determined by the printer. You cannot change it.
Cool-down curing
temperature offset This offset is added to the base
cool-down curing temperature. A long time is needed to finish
the print. The end of the print may be
damaged if the cutter is
disabled.
Minimum drying
power The minimum power applied in
the drying module while
printing, so the substrate does
not cool too much in lightly
inked areas. A heavily inked area that comes
after a lightly inked area will
have bleeding or coalescence
defects. The substrate is damaged in
blank or lightly inked areas of
the print, especially with a high
number of passes.
ENWW Add a new substrate 65
Substrate settings