Hypertherm D845GEBV2 - Manual (Page 37)

Product Description
37
1.10 Audio Subsystem
The audio subsystem consists of the following devices:
• Intel 82801DB I/O Controller Hub (ICH4)
• Analog Devices AD1981B audio codec
The audio subsystem includes these features:
• Split digital/analog architecture for improved S/N (signal-to-noise) ratio: ≥ 85 dB
• Power management support for ACPI 2.0 (driver dependant)
• Mono/Stereo mic in pre-amp that supports dynamic, condenser, and electret microphones
The audio subsystem supports the following audio interfaces:
• ATAPI-style connectors:
 Auxiliary line in
 CD-ROM
• Front panel audio connector, including pins for:
 Line out
 Mic in (mono or stereo)
• Back panel audio connectors:
 Line out
 Line in
 Mic in (mono or stereo)
Figure 8 is a block diagram of the audio subsystem.
82801DB
I/O Controller Hub
(ICH4)
OM15116
AC ’97
Link
AD1981B
Audio Codec
Auxiliary Line In
Mic In
Line Out
CD-ROM
Line In
Figure 8. Audio Subsystem Block Diagram
For information about Refer to
Upgrading the onboard audio subsystem using a CNR audio card Section 1.12, page 40
The front panel audio connector Section 2.8.2.2, page 62
The back panel audio connectors Section 2.8.1, page 60