TDK 2U GENESYS 5KW User Manual

Page 22

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83-515-000 Rev. B

14

CAUTION

Ensure that the screws used to attach the slides to the unit do
not penetrate more than 6mm into the sides of the unit.

3.4 RACK MOUNTING

The Genesys

TM

power supply series is designed to fit in a standard 19” equipment rack.

3.4.1 To install the Power Supply in a rack:

1. Use the front panel rack-mount brackets to install the power supply in the rack.
2. Use a support bar to provide adequate support for the rear of the power supply. Do not ob-

struct the air exhaust at the rear panel of the unit.

3.4.2 Rack Mount Slides (optional):

Use rack mount slides: General Devices P/N: CC3001-00-S160 or equivalent to install the unit in a
standard 19” equipment rack. Refer to Fig. 3-1 for slides assembly instructions. Use three #10-
32x0.38”(max.) screws at each side. To prevent internal damage, use the specified screw length only.

3.4.3 Plastic Supporting legs

Use the four plastic legs supplied with the unit, when the power supply is mounted on a surface or
when units are stacked without rack support. When using the plastic legs, maximum three units can
be stacked.

3.5 LOCATION, MOUNTING AND COOLING

This power supply is fan cooled. The air intake is at the front panel and the exhaust is at the rear
panel. Upon installation, allow cooling air to reach the front panel ventilation inlets. Allow a minimum
of 10cm (4 Inch) of unrestricted air space at the front and the rear of the unit.
The power supply should be used in an area that the ambient temperature does not exceed +50°C.

3.6 AC SOURCE REQUIREMENTS

The Genesys

TM

series designed for use in TN, TT and IT power distribution systems. Depending on its

input option, the Genesys

TM

5000W series can be operated from a nominal 190V to 240V. three

phase, 47~63Hz or from a nominal 380-415V, three phase 47~63Hz. The input voltage range and cur-
rent required for each model is specified in Chapter 2. Ensure that under heavy load, the AC voltage
supplied to the power supply does not fall below the specifications described in Chapter 2.

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