Hardware preparation and installation, 1 overview, 1 environmental considerations – Artesyn XMCspan Installation and Use (June 2014) User Manual

Page 17: Chapter 2

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Chapter 2

XMCSPAN Installation and Use (6806800H03C)

17

Hardware Preparation and Installation

2.1

Overview

This chapter discusses the installation of a mezzanine card and XMCspan module.

The following procedures are detailed:

Installing a Mezzanine Card

on page 20

Installing the Primary XMCspan

on page 23

Installing the Secondary XMCspan

on page 26

Removing the XMCspan

on page 28

2.1.1

Environmental Considerations

The following environmental conditions must be tested and proven in the used system
configuration. These conditions refer to the surroundings of the board within the user
environment.

Note:

Operating temperatures refer to the temperature of the air circulating around the module
and not to the component temperature.

Forced air cooling within the system is required to make sure that the operating conditions
are met.

The environmental values listed in the table only apply to the board without any
accessories. If you install accessories, you must consider their environmental
requirements.

High humidity and condensation on the surface of the board causes short circuits. Do not
operate the board outside the specified environmental limits. Make sure the board is
completely dry and there is no moisture on any surface before applying power.

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