Texas Instruments TMS320C6712D User Manual

Texas Instruments Hardware

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Table of contents

Document Outline

SPRS293A - TMS320C6712D
features
Table of Contents
REVISION HISTORY
GDP and ZDP BGA package (bottom view)
description
device characteristics
device compatibility
functional block and CPU (DSP core) diagram
CPU (DSP core) description
memory map summary
peripheral register descriptions
signal groups description
DEVICE CONFIGURATIONS
- device configurations at device reset
- DEVCFG register description
TERMINAL FUNCTIONS
- Terminal Functions
development support
- Software Development Tools:
- Hardware Development Tools:
device support
- device and development-support tool nomenclature
  - TMX
  - TMP
  - TMS
  - TMDX
  - TMDS
- documentation support
CPU CSR register description
cache configuration (CCFG) register description
interrupt sources and interrupt selector
EDMA module and EDMA selector
- ESEL0 Register (0x01A0 FF00)
- ESEL1 Register (0x01A0 FF04)
- ESEL3 Register (0x01A0 FF0C)
PLL and PLL controller
- PLLCSR Register (0x01B7 C100)
- PLLM Register (0x01B7 C110)
- Table 29. PLL Multiplier Control Register (PLLM)
- PLLDIV0, PLLDIV1, PLLDIV2, and PLLDIV3 Registers
- OSCDIV1 Register (0x01B7 C124)
general-purpose input/output (GPIO)
power-down mode logic
- triggering, wake-up, and effects
power-supply sequencing
- system-level design considerations
- power-supply design considerations
power-supply decoupling
IEEE 1149.1 JTAG compatibility statement
EMIF device speed
EMIF big endian mode correctness
bootmode
reset
absolute maximum ratings over operating case temperature range (unless otherwise noted)†
recommended operating conditions
electrical characteristics over recommended ranges of supply voltage and operating case temperature† ( unless otherwise noted)
PARAMETER MEASUREMENT INFORMATION
- signal transition levels
- AC transient rise/fall time specifications
- timing parameters and board routing analysis
INPUT AND OUTPUT CLOCKS
- timing requirements for CLKIN†‡§ (see Figure 21)
- switching characteristics over recommended operating conditions for CLKOUT2‡§ (see Figure 22)
- switching characteristics over recommended operating conditions for CLKOUT3†‡ ( see Figure 23)
- timing requirements for ECLKIN§ (see Figure 24)
- switching characteristics over recommended operating conditions for ECLKOUT†‡§ (see Figure 25)
ASYNCHRONOUS MEMORY TIMING
- timing requirements for asynchronous memory cycles†‡ (see Figure 26-Figure 27)
- switching characteristics over recommended operating conditions for asynchronous memory cycles‡§¶ (see Figure 26-Figure 27)
SYNCHRONOUS-BURST MEMORY TIMING
- timing requirements for synchronous-burst SRAM cycles† (see Figure 28)
- switching characteristics over recommended operating conditions for synchronous-burst SRAM cycles†‡ ( see Figure 28 and Figure 29)
SYNCHRONOUS DRAM TIMING
- timing requirements for synchronous DRAM cycles† (see Figure 30)
- switching characteristics over recommended operating conditions for synchronous DRAM cycles†‡ ( see Figure 30- Figure 36)
HOLD\/HOLDA\ TIMING
- timing requirements for the HOLD\/HOLDA\ cycles† (see Figure 37)
- switching characteristics over recommended operating conditions for the HOLD\/HOLDA\ cycles†‡ ( see Figure 37)
BUSREQ TIMING
- switching characteristics over recommended operating conditions for the BUSREQ cycles ( see Figure 38)
RESET TIMING
- timing requirements for reset†‡ (see Figure 39)
- switching characteristics over recommended operating conditions during reset¶ (see Figure 39)
EXTERNAL INTERRUPT TIMING
- timing requirements for external interrupts† (see Figure 40)
MULTICHANNEL BUFFERED SERIAL PORT TIMING
- timing requirements for McBSP†‡ ( see Figure 41)
- switching characteristics over recommended operating conditions for McBSP†‡ (see Figure 41)
- timing requirements for FSR when GSYNC = 1 (see Figure 42)
- timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 43)
- switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ ( see Figure 43)
- timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 44)
- switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ ( see Figure 44)
- timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 45)
- switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ ( see Figure 45)
- timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 46)
- switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ ( see Figure 46)
TIMER TIMING
- timing requirements for timer inputs† (see Figure 47)
- switching characteristics over recommended operating conditions for timer outputs† ( see Figure 47)
GENERAL-PURPOSE INPUT/OUTPUT (GPIO) PORT TIMING
- timing requirements for GPIO inputs†‡ (see Figure 48)
- switching characteristics over recommended operating conditions for GPIO outputs†§ (see Figure 48)
JTAG TEST-PORT TIMING
- timing requirements for JTAG test port (see Figure 49)
- switching characteristics over recommended operating conditions for JTAG test port ( see Figure 49)
MECHANICAL DATA
- package thermal resistance characteristics
- thermal resistance characteristics (S-PBGA package) for GDP
- thermal resistance characteristics (S-PBGA package) for ZDP
- packaging information