Drive carrier module, Drive, Carrier – Lenovo Secure Managed Client User Manual
Page 70: Module
Airflow
is
front
to
rear
with
cooling
air
being
drawn
across
the
drives,
through
the
fans
and
pressurizing
the
rear
of
the
enclosure.
The
pressurized
rear
allows
the
PSU
to
draw
the
air
that
it
requires;
perforations
at
the
rear
of
the
chassis
allow
cooling
air
to
flow
over
the
processor
heatsinks,
server
board
and
PCI
cards.
The
cooling
system
must
be
operated
with
low-pressure
rear
exhaust
installation
(back
pressure
created
by
rack
doors
and
obstacles
not
to
exceed
5
pascals
[0.5mm
Water
gauge]).
The
cooling
system
provides
sufficient
capacity
to
ensure
that
drive
maximum
temperatures
have
not
exceeded
at
35°C
(95°F)
with
one
failing
fan
at
sea
level.
The
cooling
cage
contains
ten
individual
high-speed
single-rotor
axial
fans,
individually
connected
to
and
interfacing
with
the
enclosure
management
PCB.
This
interface
provides
power
and
speed
control
to
the
fans
and
returns
speed
information
from
each
fan
to
the
management
system.
Drive
carrier
module
The
drive
carrier
module
consists
of
a
hard
disk
mounted
in
a
drive
carrier.
Each
drive
bay
can
house
a
single
low-profile
2.54-cm
(1.0-inch)
high,
8.89-cm
(3.5-inch)
form
factor
SATA
disk
drive
in
its
drive
carrier.
The
drive
carrier
has
mounting
locations
for
SATA
drives.
Each
disk
drive
is
enclosed
in
a
sheet
steel
carrier
which
provides
excellent
thermal
conduction,
radio
frequency
and
electro-magnetic
induction
protection,
as
well
as
affords
the
drive
with
maximum
physical
protection.
The
front
cap
of
the
drive
carrier
supports
an
ergonomic
handle,
which
provides
the
following
functions:
v
Camming
of
drive
carrier
into
and
out
of
drive
bays.
v
Positive
"spring
loading"
of
the
drive/backpane
connector.
Figure
11.
Cooling
fan
64
Hardware
Maintenance
Manual