Dual probe measurement mode, Probe states and modes, Probe states – INFICON Maxtek PM-700 Plating Monitor User Manual

Page 32: Failed state, Standby state, Active state, Probe modes, Ready mode, Hold mode

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PM-700 SERIES PLATING MONITOR

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In this mode both probes are actively monitoring the plating process. The monitor
compares the two probes and computes the average and the percentage difference
between the probes. A number of display modes are available.

4.4.3

Probe States and Modes

At any particular time a Probe can be in any one of three states and,
independently, in any one of three modes. For instance a Probe could be in the
Standby State and the Deplate mode or in the Standby State and the Hold mode.
The possible states and modes are described below:

4.4.3.1 Probe States

A probe can be in any one of the following three states: Failed, Standby, or
Active. The state of the probe is indicated by the three probe status LED's. (See
Figure 3.)

4.4.3.1.1 Failed

state.

A failed probe means that for some reason, the monitor is not receiving a valid
frequency signal from the probe.

4.4.3.1.2 Standby

state

The standby state indicates that the monitor is receiving a valid frequency from
the probe but the displayed information is not based on the output of this probe.

4.4.3.1.3 Active

state

The active state indicates that the probe is not failed and that it is the source of the
display information and is being used to control any active process.

4.4.3.2 Probe modes

In addition to the above, a probe may be in any one of the following four modes:
Hold, Deplate, Preplate, or Plate. The Hold and Preplate modes are applicable to
the electroless plating process. The Probe Deplate and Probe Plate mode is
applicable to both the electroless and the electrolytic plating processes.

4.4.3.2.1 Ready

mode

In the Ready mode, the probe is not in preplate, deplate, plate or hold. The
monitor does not supply current to the probe.

4.4.3.2.2 Hold

mode

In the Probe Hold mode, the plating rate on the probe is held at zero. For
electroplating processes, this is done by setting the electrode current to zero. For
electroless processes, this is done by maintaining the electrode current at the
negative value required to halt the electroless plating process. This current level
is automatically determined by the monitor.

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