INFICON Maxtek PM-700 Plating Monitor - Manual (Page 5)

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4.4.5.6 A-B)% Display ................................................................................................................ 27
4.4.6 Simulation Mode ..........................................................................................................27
4.5 P ARAMETERS .....................................................................................................................27
4.5.1 Viewing and modifying ................................................................................................27
4.5.2 Hidden parameters.......................................................................................................28
4.5.3 Descriptions .................................................................................................................28
4.5.3.1 Mode Menu ..................................................................................................................... 30
4.5.3.2 Process Menu .................................................................................................................. 32
4.5.3.3 Bath Menu ....................................................................................................................... 34
4.5.3.4 Display Menu .................................................................................................................. 36
4.5.3.5 Setup Menu ..................................................................................................................... 37
4.5.4 Restoring to Default Values .........................................................................................39
4.6 S TATUS A SSESSMENT ........................................................................................................39
4.6.1 Monitor Status..............................................................................................................39
4.6.2 Probe Status .................................................................................................................39
4.7 S WAPPING PROBES .............................................................................................................40
4.7.1 Manual probe swapping ..............................................................................................40
4.7.1.1 Assessing the probe status prior to initiating the swap. ................................................... 40
4.7.1.2 Preplating prior to swapping............................................................................................ 40
4.7.1.3 Commanding the swap. ................................................................................................... 40
4.7.1.4 Deplating the Standby Probe. .......................................................................................... 40
4.7.1.5 Manual termination of Preplate or Deplate on the Standby probe................................... 40
4.7.2 Automatic probe swapping ..........................................................................................41
4.7.2.1 Auto probe swap on active probe failure. ........................................................................ 41
4.7.2.2 Alternating Probe mode................................................................................................... 41
4.7.2.3 Failed Standby Probe inhibits automatic swap. ............................................................... 41
4.8 E XTERNAL I NTERFACE .......................................................................................................41
4.8.1 Discrete Inputs .............................................................................................................41
4.8.2 Discrete Outputs ..........................................................................................................43
4.8.3 Digital to Analog Converters .......................................................................................45
4.8.3.1 Thickness DAC................................................................................................................ 45
4.8.3.2 Rate DAC ........................................................................................................................ 45
4.8.4 Computer Connection ..................................................................................................47
4.8.4.1 RS-232 Interface.............................................................................................................. 48
4.8.4.2 Protocol ........................................................................................................................... 48
4.8.4.3 Remote Control ............................................................................................................... 49
4.8.4.3.1 Upload Parameter Store (Instruction 10h).................................................................. 49
4.8.4.3.2 Restore Parameter Store (Instruction 20h) ................................................................. 54
4.8.4.3.3 Remotely Activate (Instruction 30h) .......................................................................... 54
4.8.4.4 Remote Monitoring ......................................................................................................... 55
4.8.4.4.1 Upload Machine Status (Instruction 40h) .................................................................. 55
4.8.4.5 Data Logging ................................................................................................................... 59
4.8.4.5.1 Establish automatic data logging................................................................................ 59
4.8.4.5.2 Single data log............................................................................................................ 62
5. TROUBLESHOOTING ......................................................................................................63
5.1 T ROUBLE -S HOOTING A IDS .................................................................................................63
5.2 F AIL M ESSAGES F OLLOWING P OWER O N ...........................................................................64
5.2.1 Power Failure ..............................................................................................................64
5.2.2 Sensor Probe Failure ...................................................................................................65
5.2.3 Invalid Parameters.......................................................................................................65
5.2.4 RAM Failure ................................................................................................................65
5.2.5 ROM Failure................................................................................................................65
5.3 P ROBE F AILED I NDICATION ................................................................................................65
6. APPENDIX ..........................................................................................................................67
6.1 T HEORY OF THE Q UARTZ C RYSTAL M ICROBALANCE ........................................................67
6.1.1 Crystal Frequency........................................................................................................67
6.1.2 Crystal Health Calculation ..........................................................................................67