INFICON Maxtek PM-700 Plating Monitor - Manual (Page 4)

Table of Contents
1. GENERAL DESCRIPTION .................................................................................................1
1.1 S PECIFICATIONS ...................................................................................................................2
2. UNPACKING, INSPECTION AND BENCH CHECKOUT .............................................5
2.1 U NPACKING , I NSPECTION .....................................................................................................5
2.2 B ENCH C HECKOUT ...............................................................................................................5
3. SIMPLIFIED OPERATION...............................................................................................13
3.1 S AMPLE P ROCESS ..............................................................................................................15
4. DETAILED OPERATION..................................................................................................18
4.1 I NTRODUCTION AND G ENERAL C ONCEPTS .........................................................................18
4.2 D ISPLAYS ...........................................................................................................................18
4.3 B UTTONS ...........................................................................................................................18
4.4 O PERATION ........................................................................................................................20
4.4.1 Monitor Operating States.............................................................................................21
4.4.1.1 Electroless plating ............................................................................................................21
4.4.1.1.1 Ready State .................................................................................................................21
4.4.1.1.2 Preplate State ..............................................................................................................21
4.4.1.1.3 Plate State ...................................................................................................................21
4.4.1.1.4 Deplate State ...............................................................................................................21
4.4.1.1.5 Endpoint State.............................................................................................................21
4.4.1.2 Electrolytic plating ...........................................................................................................22
4.4.1.2.1 Ready State .................................................................................................................22
4.4.1.2.2 Plate State ...................................................................................................................22
4.4.1.2.3 Deplate State ...............................................................................................................22
4.4.1.2.4 Endpoint State.............................................................................................................22
4.4.2 Monitor Measurement Modes ......................................................................................22
4.4.2.1 Single Probe Measurement Modes ...................................................................................22
4.4.2.1.1 Continuous ..................................................................................................................22
4.4.2.1.2 Sample.........................................................................................................................23
4.4.2.1.3 Sample with Deplate ...................................................................................................23
4.4.2.2 Dual Probe Measurement Modes .....................................................................................23
4.4.2.2.1 Auto Probe Swap ........................................................................................................23
4.4.2.2.2 Alternating Measurement mode ..................................................................................23
4.4.2.2.3 Dual Probe Measurement mode ..................................................................................23
4.4.3 Probe States and Modes...............................................................................................24
4.4.3.1 Probe States......................................................................................................................24
4.4.3.1.1 Failed state. .................................................................................................................24
4.4.3.1.2 Standby state ...............................................................................................................24
4.4.3.1.3 Active state..................................................................................................................24
4.4.3.2 Probe modes .....................................................................................................................24
4.4.3.2.1 Ready mode.................................................................................................................24
4.4.3.2.2 Hold mode...................................................................................................................24
4.4.3.2.3 Deplate mode ..............................................................................................................25
4.4.3.2.4 Preplate mode..............................................................................................................25
4.4.3.2.5 Plate mode...................................................................................................................25
4.4.4 Main Display modes.....................................................................................................25
4.4.4.1 Rate and Thickness...........................................................................................................25
4.4.4.2 Rate and Efficiency ..........................................................................................................25
4.4.4.3 Efficiency and Thickness..................................................................................................25
4.4.4.4 Frequency.........................................................................................................................26
4.4.5 Parameter/Status Display modes .................................................................................26
4.4.5.1 Status Display...................................................................................................................26
4.4.5.2 Frequency Display............................................................................................................26
4.4.5.3 Elapsed Time Display.......................................................................................................26
4.4.5.4 Time to Go Display ..........................................................................................................26
4.4.5.5 Current Density Display ...................................................................................................26