NEC uPD75P3116 - Manual (Page 52)

µ
PD75P3116
52 Data Sheet U11369EJ3V0DS
12. RECOMMENDED SOLDERING CONDITIONS
The µ PD75P3116 should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
µ
PD75P3116GC-AB8: 64-pin plastic QFP (14 × 14)
Soldering Soldering Conditions Recommended
Method Condition Symbol
Infrared reflow Package peak temperature: 235 ° C, Time: 30 seconds max. (at 210 ° C or higher), IR35-00-3
Count: Three times or less
VPS Package peak temperature: 215 ° C, Time: 40 seconds max. (at 200 ° C or higher), VP15-00-3
Count: Three times or less
Wave soldering Solder bath temperature: 260 ° C max., Time: 10 seconds max., Count: Once, WS60-00-1
Preheating temperature: 120 ° C max. (package surface temperature)
Partial heating Pin temperature: 300 ° C max., Time: 3 seconds max. (per pin row) —
Caution Do not use different soldering methods together (except for partial heating).
(2) µ PD75P3116GK-8A8: 64-pin plastic LQFP (12 × 12)
Soldering Soldering Conditions Recommended
Method Condition Symbol
Infrared reflow Package peak temperature: 235 ° C, Time: 30 seconds max. (at 210 ° C or higher), IR35-107-2
Count: Twice or less
Exposure limit: 7 days
Note (after that, prebake at 125 ° C for 10 hours)
VPS Package peak temperature: 215 ° C, Time: 40 seconds max. (at 200 ° C or higher), VP15-107-2
Count: Twice or less
Exposure limit: 7 days
Note (after that, prebake at 125 ° C for 10 hours)
Wave soldering Solder bath temperature: 260 ° C max., Time: 10 seconds max., Count: Once, WS 60-107-1
Preheating temperature: 120 ° C max. (package surface temperature)
Exposure limit: 7 days Note (after that, prebake at 125 ° C for 10 hours)
Partial heating Pin temperature: 300 ° C max., Time: 3 seconds max. (per pin row) —
Note After opening the dry pack, store it at 25 ° C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).