NEC uPD75P3116 User Manual
Page 53
µ
PD75P3116
53
Data Sheet U11369EJ3V0DS
Table 12-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
µ
PD75P3116GC-8BS: 64-pin plastic LQFP (14
×
14)
Soldering
Soldering Conditions
Recommended
Method
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
IR35-00-2
Count: Twice or less
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
VP15-00-2
Count: Twice or less
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
WS60-00-1
Preheating temperature: 120
°
C max. (package surface temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).