Renesas R61509V - Manual (Page 20)

R61509V Target Spec
Rev. 0.11 April 25, 2008, page 20 of 181
● Chip size: 19.03mm x 0.76mm
● Chip thickness: 280 μm (typ)
● Pad coordinates: Pad center
● Coordinate origin: Chip center
● Au bump size
1. 50
μm x 90μm (I/O side: No.1-262)
2. 15 μm x 100μm (LCD output side: No.263-1434)
● Au bump pitch: See pad coordinate
● Au bump height:12 μm
● Alignment mark
Table 10
Alignment marks X-axis Y-axis
(1-a) -9381.0 -251.0
Type A
(1-b) 9381.0 -251.0
㩷
㩷
㩷
㩷
㩷
X
Y
30um
30um
30um
30um
30um
20um
20um
30um 30um 30um 30um 30um
75um
75um
1-a: ( Left Alignment Mark )
150um : Alignment Mark Area X-size
150um
: Alignment
Mark Area
Y
-size
Alignment
Mark Area 30um
30um
30um
30um
30um
20um
20um
150um : Alignment Mark Area X-size
150um :
Alignment Mark
Area
Y
-size
30um 30um 30um 30um 30um
75um
75um
1-b: ( Right Alignment Mark )
Alignment
Mark Area
X
Y
Figure 2