5 specifications for the uhv bakeable sensor, 1 uhv bakeable sensor without shutter (pn bk-a0f) – INFICON UHV Bakeable Sensor User Manual
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UHV Bakeable Sensor Operating Manual
1.5 Specifications for the UHV Bakeable Sensor
Figure 1-3 UHV Bakeable Sensor
1.5.1 UHV Bakeable Sensor without Shutter (PN BK-A0F)
Maximum Temperature. . . . . . . . . . . 450°C continuous bakeout
NOTE: Water flow recommended
for deposition.
Sensor Head Size
(maximum envelope) . . . . . . . . . . . . 34 x 35 x 24 mm
(1.35 x 1.38 x 0.94 in.)
Tubes
Water . . . . . . . . . . . . . . . . . . . . . 3.2 mm (0.125 in.) OD (vacuum side)
6.4 mm (0.25 in.) OD (atmosphere side)
Coax . . . . . . . . . . . . . . . . . . . . . . 4.8 mm (0.188 in.) OD
Crystal exchange . . . . . . . . . . . . . . . Front loading, self-contained package,
cam-type locking handle
Mounting. . . . . . . . . . . . . . . . . . . . . . Four #4-40 tapped holes
(on back of sensor body)
4.57 mm (0.18 in.) thread depth
Crystal
(not included with sensor) . . . . . . . . 14 mm (0.550 in.) diameter