Document Outline

• Cover Page
• Title Pager
• Trademarks
• Disclaimer
• Disclosure
• Copyright
• Declaration Of Conformity
• Warranty
• Table Of Contents
• Chapter 1 Safety Precaution and Preparation for Use
  • 1.1 Input Power Requirements
  • 1.2 Power Entry Module
  • 1.3 Power Cord
  • 1.4 Grounding
  • 1.5 Line Fuses
  • 1.6 Power Switch
• Chapter 2 General Description
  • 2.1 Introduction
  • 2.2 Features
    • 2.2.1 Independent Film Density and Tooling Factor Parameters
    • 2.2.2 Acoustic Impedance Correction
    • 2.2.3 Parameter Display
    • 2.2.4 High Resolution Autoranged Display
    • 2.2.5 Long-Term Parameter Storage
    • 2.2.6 Multiple Computer Interfaces
    • 2.2.7 Compact Case
    • 2.2.8 DAC Output
    • 2.2.9 Multiple Crystal Frequencies
    • 2.2.10 Built In Test
    • 2.2.11 Dynamic Measurement Update Rate
    • 2.2.12 Automatic Crystal Switching (TM-400 Only)
  • 2.3 Specifications
    • 2.3.1 Measurement
    • 2.3.2 Display
    • 2.3.3 Computer Interfaces
    • 2.3.4 Program Parameters
    • 2.3.5 Input Capability
    • 2.3.6 Output Capability
    • 2.3.7 Other
  • 2.4 Accessories
• Chapter 3 Unpacking and Inspection
  • 3.1 Introduction
  • 3.2 Bench Check-Out
  • 3.3 Installing Options
    • 3.3.1 IEEE-488 Option Board
    • 3.3.2 RS-485 Option
  • 3.4 Digital To Analog Converter (DAC) Checkout
• Chapter 4 Monitor Installation
  • 4.1 Monitor Installation Precautions
    • 4.1.1 Proper Grounding
    • 4.1.2 Heat Dissipation
  • 4.2 Rear Panel Connections
    • 4.2.1 Oscillator Connector(s)
    • 4.2.2 IEEE-488 Option Board (optional)
    • 4.2.3 Digital To Analog Converter (DAC) Connection
    • 4.2.4 Remote TTL Inputs
    • 4.2.5 Relay Outputs
    • 4.2.6 Line Voltage Selection and Fuse Replacement
  • 4.3 Internal DIP Switches
    • 4.3.1 Crystal Type Selection
    • 4.3.2 Computer Interface Address
    • 4.3.3 DAC
    • 4.3.4 Disable Negative Thickness/Rate Readings
    • 4.3.5 Allow Crystal Switching to a Failed Sensor (TM-400 Only)
    • 4.3.6 Pulse Switch At Thickness Endpoint
    • 4.3.7 S16 Switch Settings
    • 4.3.8 DAC Range Settings
  • 4.4 Monitor Cover Removal
• Chapter 5 Sensor, Feedthrough and Oscillator
  • 5.1 Sensor Head Description
  • 5.2 Sensor Head Installation
  • 5.3 Instrumentation Feedthrough Installation
  • 5.4 Sensor Oscillator Installation
• Chapter 6 Sensor Crystal Replacement
  • 6.1 Introduction
• Chapter 7 Operation
  • 7.1 Front Panel Displays
  • 7.2 Front Panel Controls
  • 7.3 Display and Modification Of Parameters
  • 7.4 Thickness Set Point Shutter Control
  • 7.5 Crystal Test Display
  • 7.6 Crystal Fail Indication
  • 7.7 Power Fail Indication
  • 7.8 DAC Operation
• Chapter 8 Theory of Operation
  • 8.1 Basic Measurement
  • 8.2 Film Thickness Calculation
  • 8.3 Crystal Health Calculation
  • 8.4 Rate Calculation
• Chapter 9 Establishing The Deposition Parameters
  • 9.1 Introduction
  • 9.2 Tooling Factor
  • 9.3 Sensor Number (TM-400 Only)
  • 9.4 Density
  • 9.5 Acoustic Impedance
  • 9.6 Empirical Calibration
    • 9.6.1 Material Density Calibration
    • 9.6.2 Tooling Factor Calibration
    • 9.6.3 Acoustic Impedance
• Chapter 10 Computer Interface
  • 10.1 General
  • 10.2 RS-232 Serial Interface
  • 10.3 RS-485 Serial Interface
  • 10.4 IEEE-488 Parallel Interface
  • 10.5 Protocol
  • 10.6 Data Types
  • 10.7 Message Received Status
  • 10.8 Instruction Summary
  • 10.9 Instruction Descriptions
• Chapter 11 Repair and Maintenance
  • 11.1 Handling Precautions
  • 11.2 Maintenance Philosophy
  • 11.3 Self Test Failure Detection
    • 11.3.1 EPROM Failure (E FAIL)
    • 11.3.2 RAM Failure (I FAIL)
    • 11.3.3 Film Data Failure (C-FAIL)
    • 11.3.4 Power Failure (P-FAIL)
    • 11.3.5 Oscillator Failure (O-FAIL)
    • 11.3.6 Sensor Card Failure (S FAIL)
  • 11.4 Troubleshooting Aids To Isolate Installation Faults
  • 11.5 How To Contact Customer Support
  • 11.6 Returning Your Instrument to INFICON