Motorola SSETM 5000 - Manual (Page 84)

November 11, 2004 6881094C12-A
7-2 Disassembly/Reassembly Procedures: Handling Precautions
7.2 Handling Precautions
Complementary metal-oxide semiconductor (CMOS) devices, and other high-technology devices,
are used in this family of radios. While the attributes of these devices are many, their characteristics
make them susceptible to damage by electrostatic discharge (ESD) or high-voltage charges.
Damage can be latent, resulting in failures occurring weeks or months later. Therefore, special
precautions must be taken to prevent device damage during disassembly, troubleshooting, and
repair. Handling precautions are mandatory for this radio, and are especially important in low-
humidity conditions. DO NOT attempt to disassemble the radio without observing the following
handling precautions.
1. Eliminate static generators (plastics, Styrofoam, etc.) in the work area.
2. Remove nylon or double-knit polyester jackets, roll up long sleeves, and remove or tie back
loose-hanging neckties.
3. Store and transport all static-sensitive devices in ESD-protective containers.
4. Disconnect all power from the unit before ESD-sensitive components are removed or inserted
unless otherwise noted.
5. Use a static-safeguarded workstation, which can be accomplished through the use of an anti-
static kit (Motorola part number 0180386A82). This kit includes a wrist strap, two ground
cords, a static-control table mat and a static-control floor mat.
If the radio battery contact area becomes wet, dry and clean the radio battery contacts before
attaching a battery to the radio. Otherwise, the water could short-circuit the radio.
If the radio has come into contact with water, shake the radio briskly so that any water that is trapped
inside the speaker grille and microphone port can be removed. Otherwise, the water will decrease
the audio quality of the radio.
• The SSE 5000 radio casting has one vent port that allows for pressure
equalization in the radio. Never poke this vent with any objects, such as
needles, tweezers, or screwdrivers.
• The pressure equalization vent is located on the chassis, just below the
battery contact. Never obstruct or cover the two slots with any object,
including a label. Ensure that no oily substances come in contact with this
vent.
To maintain the integrity of the RF PA, never heat it above
210
° C while performing repair or rework procedures. To
prevent overheating the RF PA during rework, use a
ChipMaster (R1319 or R1321) top-side pre-heat set point of
215
° C and a Dragon (R1427) bottom-side pre-heat set point
of 204 ° C for 1 minute before and throughout top-side heat
application, assuming that the RF PA is removed from the
applied heat 10 seconds after reflow occurs. (The RF PA
temperature does not reach the ChipMaster’s internal set
point temperature). All other parts on the transceiver board
can be reworked with ChipMaster top-side heat alone.
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