Digital audio capability, Digital audio interface (dai) – Cirrus Logic EP7312 User Manual

Page 7

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DS508F2

Copyright Cirrus Logic, Inc. 2011

(All Rights Reserved)

7

EP7312

High-Performance, Low-Power System on Chip

The second is the programmable 16- or 32-bit-wide SDRAM
interface that allows direct connection of up to two banks of
SDRAM, totaling 512 Mb. To assure the lowest possible power
consumption, the EP7312 supports self-refresh SDRAMs,
which are placed in a low-power state by the device when it
enters the low-power Standby State.

Table 3

shows the

SDRAM Interface pin assignments.

Note:

1. Pins A[27:13] map to DRA[0:14] respectively.

(i.e. A[27}/DRA[0}, A[26}/DRA[1], etc.) This is to

balance the load for large memory systems.
2. Pins are multiplexed. See

Table 19 on page 11

for

more information.

Digital Audio Capability

The EP7312 uses its powerful 32-bit RISC processing engine
to implement audio decompression algorithms in software. The
nature of the on-board RISC processor, and the availability of
efficient C-compilers and other software development tools,
ensures that a wide range of audio decompression algorithms
can easily be ported to and run on the EP7312

Universal Asynchronous
Receiver/Transmitters (UARTs)

The EP7312 includes two 16550-type UARTs for RS-232
serial communications, both of which have two 16-byte FIFOs
for receiving and transmitting data. The UARTs support bit
rates up to 115.2 kbps. An IrDA SIR protocol encoder/decoder
can be optionally switched into the RX/TX signals to/from
UART 1 to enable these signals to drive an infrared

communication interface directly.

Table 4

shows the UART pin

assignments.

Digital Audio Interface (DAI)

The EP7312 integrates an interface to enable a direct
connection to many low cost, low power, high quality audio
converters. In particular, the DAI can directly interface with
the Crystal

CS43L41/42/43 low-power audio DACs and the

Crystal

CS53L32 low-power ADC. Some of these devices

feature digital bass and treble boost, digital volume control and
compressor-limiter functions.

Table 5

shows the DAI Interface

pin assignments.

Note:

See

Table 18 on page 11

for information on pin

multiplexes.

Table 3. SDRAM Interface Pin Assignments

Pin Mnemonic

I/O

Pin Description

SDCLK

O

SDRAM clock output

SDCKE

O

SDRAM clock enable output

nSDCS[1:0]

O

SDRAM chip select out

WRITE/nSDRAS

(Note 2)

O

SDRAM RAS signal output

nMOE/nSDCAS

(Note 2)

O

SDRAM CAS control signal

nMWE/nSDWE

(Note 2)

O

SDRAM write enable control
signal

A[27:15]/DRA[0:12]

(Note 1)

O

SDRAM address

A[14:13]/DRA[12:14]

O

SDRAM internal bank select

PD[7:6]/SDQM[1:0]

(Note 2)

I/O

SDRAM byte lane mask

SDQM[3:2]

O

SDRAM byte lane mask

D[31:0]

I/O

Data I/O

Table 4. Universal Asynchronous Receiver/Transmitters Pin

Assignments

Pin Mnemonic

I/O

Pin Description

TXD[1]

O

UART 1 transmit

RXD[1]

I

UART 1 receive

CTS

I

UART 1 clear to send

DCD

I

UART 1 data carrier detect

DSR

I

UART 1 data set ready

TXD[2]

O

UART 2 transmit

RXD[2]

I

UART 2 receive

LEDDRV

O

Infrared LED drive output

PHDIN

I

Photo diode input

Table 5. DAI Interface Pin Assignments

Pin Mnemonic

I/O

Pin Description

SCLK

O

Serial bit clock

SDOUT

O

Serial data out

SDIN

I

Serial data in

LRCK

O

Sample clock

MCLKIN

I

Master clock input

MCLKOUT

O

Master clock output

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