Lenze SCF frequency inverter - Manual (Page 55)

Lenze 13466146 EDBSF01 v24 EN
55
Appendix
A Through-Hole Mount Option
The Through-Hole Mount option for the SCF drive allows the drive to be mounted with the heatsink
outside of the enclosure for better heat dissipation. This is done by using a special heatsink that mounts
to the outside of the enclosure. The drive (which has a flat plate instead of a heatsink) is mounted
to the heatsink from the inside of the enclosure. This requires cutting a hole in the enclosure that
is slightly smaller than the heatsink. Up to NEMA 4X can be achieved with this option. Panel cutout
and mounting hole dimensions are provided below for the different drive sizes.
NOTE
The temperature inside the enclosure must be maintained at 50°C or less, and the
ambient temperature outside of the enclosure must be 40°C or less. Refer to Section
2.4 - SCF Ratings for heat loss information.
THROUGH-HOLE DRAWING FOR MODELS UP TO 10 HP (7.5 kW)
HEATSINK
0.24 (6)
0.22 (5.6)
0.95 (24)
PANEL
CUTOUT
0.63 (16)
0.95 (24)
W
H
A B
E
A
MOUNTING
HOLES (#8)
0.63
(16)
E
F
F
J K
K J
B
C
TOP
Cutout view above is shown from the drive side (inside) of the panel.