Rockwell Automation 1771-IXHR , D17716.5.80 HIGH RESOL.THERMOCOUPLE - Manual (Page 13)

Installing the High Resolution
Thermocouple/Millivolt Input Module
Chapter 3
3Ć2
Add this value to the requirements of all other modules in the I/O chassis to
prevent overloading the chassis backplane and/or backplane power supply.
Place your module in any slot of the I/O chassis except for the extreme left slot.
This slot is reserved for processors or adapter modules.
Group your modules to minimize adverse affects from radiated electrical noise
and heat. We recommend the following.
Group analog and low voltage DC modules away from AC modules or high
voltage DC modules to minimize electrical noise interference.
Do not place this module in the same I/O group with a discrete high–density
I/O module when using 2–slot addressing. This module uses a byte in both
the input and output image tables for block transfer.
After determining the module’s location in the I/O chassis, connect the wiring
arm to the pivot bar at the module’s location.
Use the plastic keying bands, shipped with each I/O chassis, for keying the I/O
slot to accept only this type of module.
The input modules are slotted in two places on the rear edge of the circuit
board. The position of the keying bands on the backplane connector must
correspond to these slots to allow insertion of the module. You can key any
connector in an I/O chassis to receive these modules except for the leftmost
connector reserved for adapter or processor modules. Place keying bands
between the following numbers labeled on the backplane connector
(Figure 3.1):
Between 20 and 22
Between 24 and 26
You can change the position of these bands if subsequent system design and
rewiring makes insertion of a different type of module necessary. Use
needlenose pliers to insert or remove keying bands.
Figure 3.1
Keying Positions
Module Location in the
I/O Chassis
Module Keying