Matsushita CF-T5LWETZ1 2 - Manual (Page 47)

47
9.3.3. Assembly knowhow of the Main Board
9.3.3.1. Putting tapes for Memory Sheet of top side
9.3.3.2. Assembly of the MDC MODEM
Be sure to bond neatly for the memory heat radiation purpose material
Board slit externals match
0 1mm
There must not be running aground
Top side memory Sheet
Board slit externals match
0 1mm
Safety work
It is confirmed that top side memo-
ry Sheet does not run aground on
the switch.
Bond neatly for the memory heat
radiation purpose material
MDC PLATE Fixed treatment
device
Hits to the side
Hits to the side
10 3mm
Pattern 1
Pattern 1 Please execute either work
of or pattern 2
Washer, Sleeve A and Sleeve B Washer, Sleeve A and Sleeve B
It is unnecessary in mk2. It is unnecessary in mk2.
Continue and use mk1. Continue and use mk1.
Board's edge match
0 1mm
MDC MODEM
The tape must overlap with the
shrinkage tube by 1mm or more.
Safety work
Affixes to the back
of Board
MODEM Cable
PET Tape
Hits to the treatmen
to device
Pattern 2
Washer
Sleeve A Sleeve B
Screw
MDC PLATE