8 mechanical data, 1 thermal data, 2 packaging information – Texas Instruments TMS320C6454 User Manual
Page 217: Product preview, 8mechanical data, 1 thermal data 8.2 packaging information
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PRODUCT PREVIEW
8
Mechanical Data
8.1 Thermal Data
8.2 Packaging Information
TMS320C6454
Fixed-Point Digital Signal Processor
SPRS311A – APRIL 2006 – REVISED DECEMBER 2006
shows the thermal resistance characteristics for the PBGA - ZTZ/GTZ mechanical package.
Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [ZTZ/GTZ]
NO.
°C/W
AIR FLOW
(m/s
(1)
)
1
R
Θ
JC
Junction-to-case
1.45
N/A
2
R
Θ
JB
Junction-to-board
8.34
N/A
3
16.1
0.00
4
13.0
1.0
R
Θ
JA
Junction-to-free air
5
11.9
2.0
6
10.7
3.0
0.37
0.00
0.89
1.0
7
Psi
JT
Junction-to-package top
1.01
1.5
1.17
3.00
7.6
0.00
6.7
1.0
8
Psi
JB
Junction-to-board
6.4
1.5
5.8
3.00
(1)
m/s = meters per second
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
Mechanical Data
217