Northern Connectors Harting D-sub Connectors, Housings & Accessories - Manual (Page 174)

05
173
D-Sub
M F
M F
M F
M F
M F
D-Sub
Standard press-in connectors Technical characteristics
Current carrying capacity
The current carrying capacity is limited by maximum temperature
of materials for inserts and contacts including terminals.
The current capacity-curve is valid for continuous, not interrupted
current-loaded contacts of connectors when simultaneous power
on all contacts is given, without exceeding the maximum tempera-
ture.
Control and test procedures according to DIN IEC 60 512.
Contact arrangement View from termination side
Mating conditions as per DIN 41 652
M = Male connector
F = Female connector
W
or
king current
Ambient temperature
Example: 25 way connector
➀ Stamped contacts
1) Performance level 3, 50 mating cycles, no gas test
Performance level 2 as per CECC 75 301-802, 250 mating cycles, 4 days 4 mixed gas test – IEC 60 512
Performance level 1 as per CECC 75 301-802, 500 mating cycles, 10 days 4 mixed gas test – IEC 60 512
37 way 50 way
9 way
15 way
25 way
Number of contacts 9, 15, 25, 37, 50
UL recognized
Working current
see current carrying capacity chart
Stamped contacts 6.5 A max.
Test voltage U
r.m.s.
1 kV
Clearance and creepage ≥ 1.0 mm
Contact resistance ≤ 10 mΩ
Insulation resistance ≥ 10 10 Ω
Temperature range -55 O C … +125 O C
The higher temperature limit includes the local ambient and
heating effect of the contacts under load
Terminations Recommended PCB through holes
Materials
Mouldings and hoods Liquid Crystal Polymer (LCP)
UL 94-V0
Contacts Copper alloy
Contact surface
Contact zone selectively plated
acc. to performance level 1)
Metal shell Plated steel
Insertion and withdrawal force
Connector on P.C.B.
Press-in without grounding pins
– insertion max. per contact: ≤ 120 N
– withdrawal min. per contact: ≤ 20 N
Press-in with grounding pins
– insertion max. per grounding pin: ≤ 250 N
– withdrawal min. per grounding pin: ≤ 30 N
Mating force 9 way ≤ 30 N
15 way ≤ 50 N
25 way ≤ 83 N
37 way ≤ 123 N
50 way ≤ 167 N
Signal pin Grounding pin
Tin-lead plated PCB Hole 1.15 -0.03 3.15 ±0.025
Cu 25-75 µm 25-75 µm
Sn 5-15 µm 4-10 µm
Plated hole 0.94-1.09 mm 3.0-3.15 mm
Chemical Hole 1.05 -0.03 3.15 ±0.025
tin-plated PCB Cu 25-50 µm 25-50 µm
Sn 0.8-1.0 µm 0.8-1.0 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
Au / Ni plated PCB Hole 1.15 -0.03 3.15 ±0.025
Cu 25-50 µm 25-50 µm
Ni 3-7 µm 4-7 µm
Au 0.05-0.12 µm 0.05-0.12 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
Silver plated PCB Hole 1.15 -0.03 3.15 ±0.025
Cu 25-50 µm 25-50 µm
Ag 0.1-0.3 µm 0.1-0.3 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
OSP Hole 1.15 -0.03 3.15 ±0.025
copper plated PCB Cu 25-50 µm 25-50 µm
Plated hole 1.00-1.10 mm 3.0-3.15 mm
PCB board thickness: ≥ 1.6 mm