Intel 80960HD - Manual (Page 32)

80960HA/HD/HT
32 Datasheet
Table 12. Maximum T
A
at Various Airflows in °C (PGA Package Only)
Airflow-ft/min (m/sec)
f
CLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
Core
1X Bus
Clock
T
A
with
Heatsink †
25
33
40 69
63
59 74
70
67 78
75
73 79
77
75 80
79
77 80
79
77
T
A
without
Heatsink
25
33
40 64
56
50 67
62
56 71
67
63 74
70
67 75
72
69 76
74
71
Core
2X Bus
Clock
T
A
with
Heatsink †
16
25
33
40 68
58
49
41 73
66
60
55 77
73
69
65 79
75
71
68 80
77
74
72 80
77
74
72
T
A
without
Heatsink
16
25
33
40 62
49
38
27 66
56
46
38 71
62
55
48 73
66
60
55 75
68
63
58 76
71
66
62
Core
3X Bus
Clock
T
A
with
Heatsink †
20
25 53
45 63
58 71
67 73
70 76
73 76
73
T
A
without
Heatsink
20
25 43
33 51
42 58
51 63
58 66
61 68
64
† *0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 13. 80960Hx 168-Pin PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.07)
800
(4.06)
1000
(5.07)
θ Junction-to-Case
(Case measured as
shown in
Figure 5 .)
1.5 1.5 1.5 1.5 1.5 1.5
θ
Case-to-Ambient
(No Heatsink)
17 14 11 9 8 7
θ Case-to-Ambient
(With Heatsink) 3
13 9 6 5 4 4
NOTES:
1. This table applies to 80960Hx PGA plugged into socket or soldered directly to board.
2.
θ
JA
=
θ
JC
+
θ
CA
3. 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
θ
JC
θ
JA